Scholarlink

<p>This study examines the influence of different substrate materials on the structural, mechanical, and hydrophobic properties of diamond-like carbon (DLC) films deposited using the PECVD technique. Substrates including stainless steel, silicon, Silica, and epoxy chip material were investigated to understand their impact on the performance of DLC coatings. Raman, FTIR spectroscopy and XPS revealed substrate-dependent variations in bonding configurations, with stainless steel exhibiting prominent sp2 clustering and graphitization, while Silica displayed a predominantly amorphous structure with enhanced sp3 content. Silicon demonstrated superior mechanical properties, attributed to its hexagonal DLC morphology and higher sp3 bonding, making it ideal for demanding applications. Epoxy chip material, characterized by a globular DLC structure and higher sp2 content, exhibited lower mechanical performance but moderate hydrophobicity. Silica was identified as the most hydrophobic substrate, followed by silicon, epoxy chip, and stainless steel. These findings underscore the importance of substrate characteristics and structural tailoring in optimizing DLC coatings for diverse industrial applications, including protective, tribological, and water-repellent surfaces.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Substrate-dependent properties of PECVD-deposited diamond-like carbon films: structural, morphological, and mechanical insights

  • 期刊论文

  • 发表日期：

    2025年8月1日

查看全文
  • Mohd Sarim Khan,
  • Lokendra Kumar Katiyar,
  • Manish Kumar,
  • C. Sasikumar

摘要

This study examines the influence of different substrate materials on the structural, mechanical, and hydrophobic properties of diamond-like carbon (DLC) films deposited using the PECVD technique. Substrates including stainless steel, silicon, Silica, and epoxy chip material were investigated to understand their impact on the performance of DLC coatings. Raman, FTIR spectroscopy and XPS revealed substrate-dependent variations in bonding configurations, with stainless steel exhibiting prominent sp2 clustering and graphitization, while Silica displayed a predominantly amorphous structure with enhanced sp3 content. Silicon demonstrated superior mechanical properties, attributed to its hexagonal DLC morphology and higher sp3 bonding, making it ideal for demanding applications. Epoxy chip material, characterized by a globular DLC structure and higher sp2 content, exhibited lower mechanical performance but moderate hydrophobicity. Silica was identified as the most hydrophobic substrate, followed by silicon, epoxy chip, and stainless steel. These findings underscore the importance of substrate characteristics and structural tailoring in optimizing DLC coatings for diverse industrial applications, including protective, tribological, and water-repellent surfaces.