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<p>An aerosolized liquid phase reaction method is proposed for the continuous preparation of highly dispersed copper nanoparticles. The copper precursor solution and reducing agent solution are mixed and aerosolized immediately into microdroplets, which prevents the synthesized copper nanoparticles from coming into contact and forming agglomerates. Compared to the traditional liquid phase synthesis of copper nanoparticles, this method reduces the average size of the nanoparticles from 309 to 210&#xa0;nm and the maximum size of the agglomerates from ~ 10 to ~ 3&#xa0;μm. As a result, the shear strength of the sintered joint made with the aerosol-produced nanoparticles is improved from 33 to 57&#xa0;MPa, and the electrical resistance is reduced from 4.3 × 10<sup>–7</sup> to 6.1 × 10<sup>–8</sup> Ω·m. This method provides an effective approach to decrease agglomeration and improve the performance of metal nanoparticles for electronic packaging applications.</p> Graphical Abstract <p></p>

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Aerosolized liquid phase reaction method: an approach for the continuous preparation of highly dispersed copper nanoparticles

  • 期刊论文

  • 发表日期：

    2025年1月20日

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  • Guannan Yang,
  • Weiwei He,
  • Wenzhe Wang,
  • Xianhao Da,
  • Shengtao Yu,
  • Qian Xiong,
  • Tianshuo Zhao,
  • Guanghan Huang,
  • Yu Zhang,
  • Chengqiang Cui

摘要

An aerosolized liquid phase reaction method is proposed for the continuous preparation of highly dispersed copper nanoparticles. The copper precursor solution and reducing agent solution are mixed and aerosolized immediately into microdroplets, which prevents the synthesized copper nanoparticles from coming into contact and forming agglomerates. Compared to the traditional liquid phase synthesis of copper nanoparticles, this method reduces the average size of the nanoparticles from 309 to 210 nm and the maximum size of the agglomerates from ~ 10 to ~ 3 μm. As a result, the shear strength of the sintered joint made with the aerosol-produced nanoparticles is improved from 33 to 57 MPa, and the electrical resistance is reduced from 4.3 × 10–7 to 6.1 × 10–8 Ω·m. This method provides an effective approach to decrease agglomeration and improve the performance of metal nanoparticles for electronic packaging applications.

Graphical Abstract