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<p>This study aims to improve heat dissipation performance using sinusoidal surface geometries applied to a commercial heat sink. It also presents, for the first time, a systematic parametric Computational Fluid Dynamics (CFD) framework that integrates the effects of surface roughness, coating, and fan orientation. Initially, 20 fin designs with different wave sizes were evaluated. The three most efficient types were then selected, and variables such as vertical and horizontal wave orientations, aluminum and copper material differences, vertical and horizontal forced fan flow, and anodized coating were systematically investigated. The findings indicate that sinusoidal surface geometries provide approximately an 8–10% reduction in maximum solid temperature compared to flat fins; the coating contributes an additional 5–7% to this improvement; and copper alloy achieves approximately 10–12% lower temperatures compared to aluminum under similar conditions. It has been demonstrated that the combination of orientation and fan type can achieve a total improvement of up to 25%. These results will provide the basis for designing more compact and highly efficient heat sinks for electronic cooling applications.</p>

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CFD analysis of sinusoidal roughness and anodic coating in plate-fin heat sinks

  • 期刊论文

  • 发表日期：

    2026年7月21日

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  • Özgür Özdilli

摘要

This study aims to improve heat dissipation performance using sinusoidal surface geometries applied to a commercial heat sink. It also presents, for the first time, a systematic parametric Computational Fluid Dynamics (CFD) framework that integrates the effects of surface roughness, coating, and fan orientation. Initially, 20 fin designs with different wave sizes were evaluated. The three most efficient types were then selected, and variables such as vertical and horizontal wave orientations, aluminum and copper material differences, vertical and horizontal forced fan flow, and anodized coating were systematically investigated. The findings indicate that sinusoidal surface geometries provide approximately an 8–10% reduction in maximum solid temperature compared to flat fins; the coating contributes an additional 5–7% to this improvement; and copper alloy achieves approximately 10–12% lower temperatures compared to aluminum under similar conditions. It has been demonstrated that the combination of orientation and fan type can achieve a total improvement of up to 25%. These results will provide the basis for designing more compact and highly efficient heat sinks for electronic cooling applications.