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<p>This research investigates the mechanical, thermal, electromagnetic interference (EMI) shielding, and dielectric properties of vinyl ester composites reinforced with <i>Grewia optiva</i> fiber, copper oxide (CuO) nanoparticles, and banyan leaf-derived activated biochar. The biochar was chemically activated using potassium hydroxide (KOH), and its surface morphology was analyzed using Field Emission Scanning Electron Microscopy (FESEM). Composites were fabricated via the hand layup method with a constant 40% <i>Grewia optiva</i> fiber content and varying filler loadings (0.5%, 1%, and 2%). All the test was conducted according to ASTM standards. Among the samples, the VSF2 composite demonstrated the highest tensile strength (152&#xa0;MPa), flexural strength (202&#xa0;MPa), and impact energy absorption (4.80&#xa0;J). Scanning Electron Microscopy (SEM) revealed the failure modes and microstructural characteristics of the fractured samples. The VSF3 composite exhibited the highest hardness (91 Shore D), EMI shielding effectiveness ranging from 10.6 to 36.21&#xa0;dB in the 2–20&#xa0;GHz frequency range, and the highest dielectric constant (7.52 at 3.34&#xa0;GHz) with a dielectric loss of 0.21 to 0.40 across the frequency range. Furthermore, it showed excellent thermal stability with a maximum decomposition temperature of 456&#xa0;°C. These results indicate that the developed composites are suitable for lightweight EMI shielding components, electronic housings, and thermally stable structural panels for aerospace and automotive applications.</p>

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Eco-friendly Grewia optiva fiber, CuO nanoparticles and banyan derived activated biocarbon toughened composites for EMI shielding effectiveness in battery management systems and wireless charging

  • 期刊论文

  • 发表日期：

    2026年4月4日

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  • K. K. Manivannan,
  • V. Gnanamoorthi

摘要

This research investigates the mechanical, thermal, electromagnetic interference (EMI) shielding, and dielectric properties of vinyl ester composites reinforced with Grewia optiva fiber, copper oxide (CuO) nanoparticles, and banyan leaf-derived activated biochar. The biochar was chemically activated using potassium hydroxide (KOH), and its surface morphology was analyzed using Field Emission Scanning Electron Microscopy (FESEM). Composites were fabricated via the hand layup method with a constant 40% Grewia optiva fiber content and varying filler loadings (0.5%, 1%, and 2%). All the test was conducted according to ASTM standards. Among the samples, the VSF2 composite demonstrated the highest tensile strength (152 MPa), flexural strength (202 MPa), and impact energy absorption (4.80 J). Scanning Electron Microscopy (SEM) revealed the failure modes and microstructural characteristics of the fractured samples. The VSF3 composite exhibited the highest hardness (91 Shore D), EMI shielding effectiveness ranging from 10.6 to 36.21 dB in the 2–20 GHz frequency range, and the highest dielectric constant (7.52 at 3.34 GHz) with a dielectric loss of 0.21 to 0.40 across the frequency range. Furthermore, it showed excellent thermal stability with a maximum decomposition temperature of 456 °C. These results indicate that the developed composites are suitable for lightweight EMI shielding components, electronic housings, and thermally stable structural panels for aerospace and automotive applications.