Investigating the curing process of an epoxy resin with DSC, DEA and rotational rheometry
摘要
Kinetics analysis of a two-component epoxy resin was carried out by differential scanning calorimetry (DSC), dielectric analysis (DEA) and rotational rheometry. The analysis involves the part of reaction which is chemically controlled as well as the part which is diffusion controlled if vitrification takes place. It uses the heat evolved during the reaction (investigated by DSC), the curves of ion viscosity (investigated by DEA) and the module of the complex shear viscosity (investigated by rheometry). The modeling consists of two successive steps; the first following a Kamal–Sourour equation, the second by using an nth order simulated reaction. The kinetic parameters obtained with the different methods are compared.