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<p>With the rapid development of high-power density electronic devices, traditional cooling methods are increasingly inadequate for growing heat dissipation demands. Non-uniform microchannels have become a core solution to the heat transfer bottleneck, leveraging their advantages in inducing secondary flows. This review summarizes their heat transfer/flow performance research, focusing on typical configurations (wavy, bionic, zigzag, convergent–divergent, topology-optimized) and secondary structures. Topology-optimized channels perform best (<i>PEC</i> = 1.6–2.3, heat transfer enhancement 50–80%), while others have distinct advantages. Current challenges include multi-physics coupling, AI-driven design, and scalable manufacturing; future research should promote interdisciplinary translation to engineering applications.</p>

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Study on the effects of non-uniform structures on enhanced heat transfer and flow performance

  • 期刊论文

  • 发表日期：

    2026年3月3日

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  • Baojia Liu,
  • Zunmin Liu,
  • Yuan Xi,
  • Xilong Zhang,
  • Zhaotong Zhang

摘要

With the rapid development of high-power density electronic devices, traditional cooling methods are increasingly inadequate for growing heat dissipation demands. Non-uniform microchannels have become a core solution to the heat transfer bottleneck, leveraging their advantages in inducing secondary flows. This review summarizes their heat transfer/flow performance research, focusing on typical configurations (wavy, bionic, zigzag, convergent–divergent, topology-optimized) and secondary structures. Topology-optimized channels perform best (PEC = 1.6–2.3, heat transfer enhancement 50–80%), while others have distinct advantages. Current challenges include multi-physics coupling, AI-driven design, and scalable manufacturing; future research should promote interdisciplinary translation to engineering applications.