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<p>Passive thermal management of electronic devices employing circular fin–pin heat sinks embedded with phase-change materials (PCMs) that enhance thermal conductivity via mono-/hybrid nanoparticles is the focus of the present investigation. Two categories of nano-enhanced PCM were fabricated [mono-nano-PCM (MPCM) and hybrid nano-PCM (HPCM)] by combining paraffin wax (PFW) with 0.5 and 1.0 mass% of silver (Ag) and titanium dioxide (TiO<sub>2</sub>) nanoparticles. The effect of nanoparticles on the thermophysical properties of paraffin wax was studied using differential scanning calorimetry, thermogravimetric analysis, and thermal conductivity measurement. Experimental investigations were conducted with unfinned heat sink (UHS) and circular finned heat sink (FHS) incorporating MPCM and HPCM with three power levels of 5 W, 10 W, and 15 W. The results demonstrated a maximum relative improvement of around 96.65% in thermal conductivity. The performance study of the circular finned heat sinks (CFHS) with PCM, HPCM, and MPCM shows peak temperature reduction of 12.5–28.6%. In particular, at 5 W, 10 W, and 15 W, MPCM_CFHS offers the greatest reduction (28.6%, 22.7%, and 22.5%, respectively). Comparatively performance study of unfinned heat sink with PCM, HPCM, and MPCM shows reductions between 7.1% and 20.6%, where HPCM routinely achieved the lowest temperatures, with drops of 20.6%,17.9%, and 14.3%. at different power levels. These percentages highlight the superior effectiveness, specifically MPCM and HPCM, incorporating into heat sinks to enhance thermal management. Also, maximum enhancement ratios of 1.28 and 1.8 were achieved at 55&#xa0;°C and 60&#xa0;°C set point temperatures (SPTs) which are highly suggested for electronic cooling systems and thermal management application.</p>

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Thermophysical properties of hybrid nano-enhanced paraffin wax as PCM for thermal management applications

  • 期刊论文

  • 发表日期：

    2026年1月4日

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  • Mohamed Iqbal Shajahan,
  • T. Ramkumar,
  • R. Bharathiraja,
  • Gandhi Mallela

摘要

Passive thermal management of electronic devices employing circular fin–pin heat sinks embedded with phase-change materials (PCMs) that enhance thermal conductivity via mono-/hybrid nanoparticles is the focus of the present investigation. Two categories of nano-enhanced PCM were fabricated [mono-nano-PCM (MPCM) and hybrid nano-PCM (HPCM)] by combining paraffin wax (PFW) with 0.5 and 1.0 mass% of silver (Ag) and titanium dioxide (TiO2) nanoparticles. The effect of nanoparticles on the thermophysical properties of paraffin wax was studied using differential scanning calorimetry, thermogravimetric analysis, and thermal conductivity measurement. Experimental investigations were conducted with unfinned heat sink (UHS) and circular finned heat sink (FHS) incorporating MPCM and HPCM with three power levels of 5 W, 10 W, and 15 W. The results demonstrated a maximum relative improvement of around 96.65% in thermal conductivity. The performance study of the circular finned heat sinks (CFHS) with PCM, HPCM, and MPCM shows peak temperature reduction of 12.5–28.6%. In particular, at 5 W, 10 W, and 15 W, MPCM_CFHS offers the greatest reduction (28.6%, 22.7%, and 22.5%, respectively). Comparatively performance study of unfinned heat sink with PCM, HPCM, and MPCM shows reductions between 7.1% and 20.6%, where HPCM routinely achieved the lowest temperatures, with drops of 20.6%,17.9%, and 14.3%. at different power levels. These percentages highlight the superior effectiveness, specifically MPCM and HPCM, incorporating into heat sinks to enhance thermal management. Also, maximum enhancement ratios of 1.28 and 1.8 were achieved at 55 °C and 60 °C set point temperatures (SPTs) which are highly suggested for electronic cooling systems and thermal management application.