<p>The objective of this numerical study is to propose new cooling techniques for microelectronic modules under a magnetic field (MF), estimation of nanoparticle accretion rate (NAR) and the ternary hybrid nanofluid flow on microchannel walls with obstacles. This research uses a serpentine microchannel with obstacles inside the microelectronic module to pass ternary hybrid nanoparticles Al2O3–MgO–TiO2 with soybean oil as the base fluid. An obstacle with an elliptical cross section with 0.05 and 0.1 mm radii was used inside the microchannel. The flow pass from the microchannel has been investigated as single-phase model and Euler–Lagrangian two-phase model. In this study, the finite volume method to solve the equations and SIMPLE algorithm have been used for the velocity–pressure coupling. Predictions of changes in thermo-hydraulic performance (THP) parameters with the obstacle characteristics were made using least squares error model. The contribution of variables such as a change in the module wall boundary condition (MWBC), MF strength, volume flow rate (VFR), the number of obstacles, obstacles height, angle (<i>θ</i>), and type of fluid passing through the microchannel on the THP parameters has been determined using the Taguchi method. It was observed that the impact of VFR, fluid type, MWBC, number of obstacles, obstacle height, angle (<i>θ</i>), and MF on the cooling of the microelectronic module was 23.18%, 23.85%, 18.79%, 10.49%, 10.32%, 10.65%, and 2.70%, respectively. The NAR rose to 4.8, 4.92, and 1.7 times with a 2.5 times increase in the obstacle height, 1.6 times the number of obstacles, and 0.25 times the angle (<i>θ</i>), respectively. The results also indicated that a doubling the VFR of 0.025–0.05&#xa0;mL s<sup>−1</sup>s can help avoid the deposition of nanoparticles on the microchannel wall.</p>

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Multi-sectoral prediction of factors affecting the cooling of microelectronic modules and ternary hybrid nanoparticle accretion rate on serpentine microchannel walls with obstacles

  • Ali Salehin,
  • Arash Mirabdolah Lavasani,
  • Mohammad Nimafar,
  • Gholamreza Salehi,
  • Mohammad Vahabi

摘要

The objective of this numerical study is to propose new cooling techniques for microelectronic modules under a magnetic field (MF), estimation of nanoparticle accretion rate (NAR) and the ternary hybrid nanofluid flow on microchannel walls with obstacles. This research uses a serpentine microchannel with obstacles inside the microelectronic module to pass ternary hybrid nanoparticles Al2O3–MgO–TiO2 with soybean oil as the base fluid. An obstacle with an elliptical cross section with 0.05 and 0.1 mm radii was used inside the microchannel. The flow pass from the microchannel has been investigated as single-phase model and Euler–Lagrangian two-phase model. In this study, the finite volume method to solve the equations and SIMPLE algorithm have been used for the velocity–pressure coupling. Predictions of changes in thermo-hydraulic performance (THP) parameters with the obstacle characteristics were made using least squares error model. The contribution of variables such as a change in the module wall boundary condition (MWBC), MF strength, volume flow rate (VFR), the number of obstacles, obstacles height, angle (θ), and type of fluid passing through the microchannel on the THP parameters has been determined using the Taguchi method. It was observed that the impact of VFR, fluid type, MWBC, number of obstacles, obstacle height, angle (θ), and MF on the cooling of the microelectronic module was 23.18%, 23.85%, 18.79%, 10.49%, 10.32%, 10.65%, and 2.70%, respectively. The NAR rose to 4.8, 4.92, and 1.7 times with a 2.5 times increase in the obstacle height, 1.6 times the number of obstacles, and 0.25 times the angle (θ), respectively. The results also indicated that a doubling the VFR of 0.025–0.05 mL s−1s can help avoid the deposition of nanoparticles on the microchannel wall.