<p>The continuous advancement of electronic devices has led to higher power densities, resulting in significant thermal management challenges. Efficient heat dissipation is essential to ensure the reliability, stability, and longevity of these devices. Minichannel heat sinks have gained prominence due to their compact design, high heat transfer efficiency, and capability to handle increased thermal loads. This review provides a comprehensive analysis of electronic cooling using minichannel heat sinks, focusing on critical parameters such as cooling fluid selection, fin thickness, fin spacing, flow Reynolds number, and heat transfer enhancement techniques. Key findings from recent studies reveal that optimized fin spacing and thickness can reduce base temperature by up to 44.84%, while nanofluid cooling enhances heat transfer coefficients by as much as 72%. Additionally, hybrid helical-straight minichannels have demonstrated a remarkable 94.5% improvement in overall thermal performance, and ribbed serpentine geometries have shown a 13.9% base temperature reduction compared to conventional straight channels. Moreover, the influence of entropy generation, pressure drop penalties, and thermal resistance variations is critically evaluated to identify optimal design strategies. Unlike existing reviews, this study integrates both experimental and numerical findings from the latest research to present a data-driven, comparative perspective on minichannel heat sink performance. By systematically analyzing advancements, challenges, and emerging opportunities in this field, this review serves as a valuable resource for researchers, engineers, and industry professionals seeking to develop innovative, high-performance cooling solutions for modern electronic applications.</p>