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<p>Effective thermal management is critical for improving the performance and longevity of electronic devices, industrial systems, and renewable energy technologies. This study explores the use of silver nanofluids to enhance the thermal performance of heat pipes, an important component in electronics cooling, HVAC systems, and industrial heat exchangers. Silver nanoparticles are chosen for their superior thermal conductivity compared to other commonly used materials like aluminum oxide and copper oxide, which can significantly improve heat transfer efficiency. However, the influence of nanoparticle size, filling ratio, and operational conditions on their performance in heat pipes remains underexplored. This research aims to investigate the size-dependent effects of silver nanoparticles (30&#xa0;nm, 50&#xa0;nm, and 80&#xa0;nm) on heat transfer efficiency, specifically focusing on thermal resistance (TR) and heat transfer coefficient (HTC) under various filling ratios and inclination angles. Nanofluids were prepared by dispersing silver nanoparticles into deionized water, followed by ultrasonic agitation to ensure uniform dispersion. The study found that increasing the nanoparticle size and filling ratio improved the heat transfer performance, with 80-nm nanoparticles exhibiting the best performance, significantly reducing TR and increasing HTC. At a 90% filling ratio and 90° inclination, TR dropped by 46.5% and HTC increased by 58.3% for 80-nm nanoparticles compared to DI water. These findings highlight the potential of silver nanofluids to optimize thermal management systems, suggesting future research directions to further explore their long-term stability and practical applications in high-performance cooling systems.</p>

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Size-dependent thermal behavior of silver nanofluids in heat pipes: a comparative study of nanoparticle sizes

  • 期刊论文

  • 发表日期：

    2025年1月20日

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  • Sivakumar Elumalai,
  • Manikandan Kadamban,
  • Ratchagaraja Dhairiyasamy

摘要

Effective thermal management is critical for improving the performance and longevity of electronic devices, industrial systems, and renewable energy technologies. This study explores the use of silver nanofluids to enhance the thermal performance of heat pipes, an important component in electronics cooling, HVAC systems, and industrial heat exchangers. Silver nanoparticles are chosen for their superior thermal conductivity compared to other commonly used materials like aluminum oxide and copper oxide, which can significantly improve heat transfer efficiency. However, the influence of nanoparticle size, filling ratio, and operational conditions on their performance in heat pipes remains underexplored. This research aims to investigate the size-dependent effects of silver nanoparticles (30 nm, 50 nm, and 80 nm) on heat transfer efficiency, specifically focusing on thermal resistance (TR) and heat transfer coefficient (HTC) under various filling ratios and inclination angles. Nanofluids were prepared by dispersing silver nanoparticles into deionized water, followed by ultrasonic agitation to ensure uniform dispersion. The study found that increasing the nanoparticle size and filling ratio improved the heat transfer performance, with 80-nm nanoparticles exhibiting the best performance, significantly reducing TR and increasing HTC. At a 90% filling ratio and 90° inclination, TR dropped by 46.5% and HTC increased by 58.3% for 80-nm nanoparticles compared to DI water. These findings highlight the potential of silver nanofluids to optimize thermal management systems, suggesting future research directions to further explore their long-term stability and practical applications in high-performance cooling systems.