Influence of material properties of electrodeposited copper by different modes of electrodeposition on pool boiling heat transfer

The influence of surface adhesion between the electrodeposited coating and the base material prepared by different modes of electrodeposition on pool boiling heat transfer is presented here. Electrodeposition modes, namely one-step, two-step, six-step, and inverted one-step, were applied to prepare the surface-modified copper substrate aimed at creating a microporous copper network. By implementing these methods, the copper deposit laden with numerous micropores and nano-dendrites that acts as nucleation sites for bubble generation. Among all the specimens, the sample prepared at the 1500 s of two-step deposition time reported the maximum heat transfer coefficient (h) and lowest wall superheat. The enhancement reported in all the cases was attributed to the substantial nucleation site density, interconnectivity among micropores, and superior adhesion between substrate and coating. The two-step electrodeposition time, the number of steps involved in electrodeposition, and the inverted one-step current density significantly affect the coating-base substrate adhesion, which guided for enhancement in pool boiling heat transfer. The synergic coordination between all these parameters is crucial for its ability to enhance pool boiling heat transfer.