Utilization of ultrasonic electrodeposition for fabricating isotopic nickel targets
摘要
This study examines the effects of ultrasonic treatment on the deposition of nickel coatings onto copper targets under various conditions and employs electrochemical analysis to explore the deposition mechanism of nickel on the copper surface under ultrasonic conditions. Results indicate that ultrasonic treatment at 40 kHz results in a reduced electrodeposition time from over 10 h to just 4 h and denser nickel coatings. Initially, ultrasonics decrease the deposition rate. In the intermediate and later stages of deposition, ultrasonics enhance the deposition rate, transitioning the process from diffusion-controlled under static conditions to electrochemical-controlled under ultrasonic conditions.