<p>Synthesis was initiated by blocking one isocyanate group (NCO) of the hexamethylene diisocyanate trimer (HT-100) utilizing methyl ethyl ketoxime (MEKO), followed by reaction between the blocked trimer and pyromellitic dianhydride (PMDA) to yield an NCO-terminated intermediate containing imide groups. The intermediate was then reacted with polyethylene glycol (PEG-600) and dimethylolpropionic acid (DMPA) together to undergo chain-extension. Finally, the residual NCO groups were all blocked and the free carboxyl groups were neutralized, leading to the achievement of waterborne polyisocyanate crosslinker containing imide groups (WPII). The crosslinker was characterized by FT-IR and ¹H-NMR, while its thermal properties were investigated by TG and DTG. Thermal analysis of the products derived from the application of WPII to hydroxyacrylic resin revealed an unusual phenomenon: the typical decomposition peak of the polyisocyanate soft segments was absent and the final decomposition temperature can reach 472&#xa0;°C. Meanwhile, the cured film demonstrated excellent mechanical performance, achieving a maximum relative hardness of 0.595 while maintaining an adhesion strength of 1.68&#xa0;MPa.</p>

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Synthesis and properties of waterborne polyisocyanate crosslinker comprising imide groups

  • Guang-rui Zhao,
  • Yu-hang Zhou,
  • Yu-xin Jiang,
  • Jun Wei

摘要

Synthesis was initiated by blocking one isocyanate group (NCO) of the hexamethylene diisocyanate trimer (HT-100) utilizing methyl ethyl ketoxime (MEKO), followed by reaction between the blocked trimer and pyromellitic dianhydride (PMDA) to yield an NCO-terminated intermediate containing imide groups. The intermediate was then reacted with polyethylene glycol (PEG-600) and dimethylolpropionic acid (DMPA) together to undergo chain-extension. Finally, the residual NCO groups were all blocked and the free carboxyl groups were neutralized, leading to the achievement of waterborne polyisocyanate crosslinker containing imide groups (WPII). The crosslinker was characterized by FT-IR and ¹H-NMR, while its thermal properties were investigated by TG and DTG. Thermal analysis of the products derived from the application of WPII to hydroxyacrylic resin revealed an unusual phenomenon: the typical decomposition peak of the polyisocyanate soft segments was absent and the final decomposition temperature can reach 472 °C. Meanwhile, the cured film demonstrated excellent mechanical performance, achieving a maximum relative hardness of 0.595 while maintaining an adhesion strength of 1.68 MPa.