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<p>Polymer-based thermally conductive composite materials are widely used in microelectronic heat dissipation and packaging. The interfacial thermal resistance (ITR) between fillers limits their in-plane thermal conductivity improvement. This study tailors interfacial heat transfer behavior through microstructure design. Nickel nanoparticles were in-situ reduced and anchored on boron nitride nanosheets (BNNS) via an in-situ reduction method, forming a “point-to-plane” contact interface in the BC/BNNS/MXene composite system to establish a continuous thermal conduction network. In this 3D network, uniformly dispersed MXene nanosheets are interconnected by Ni nanoparticles on BNNS, forming stable 3D heat transfer pathways. When the BS@Ni filler content was 10 wt%, the composite had a in-plane thermal conductivity of 13.8&#xa0;W m<sup>− 1</sup> K<sup>− 1</sup>, showing that Ni nanoparticles as thermal bridges reduce the contact thermal resistance between BNNS and MXene. As a thermal interface material for CPU cooling, the BM30BS@Ni10 composite film reduced the operating temperature from 84.5&#xa0;°C to 69.9&#xa0;°C. Under 80 mW·cm<sup>− 2</sup> light irradiation, the film’s surface temperature quickly rose to 85&#xa0;°C and maintained efficient photothermal conversion after ten cycles. This research offers an effective structural design strategy for high-performance polymer-based thermally conductive materials and has broad application prospects in electronic thermal management, intelligent heat regulation, and electromagnetic protection.</p>

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High-performance photothermal conversion and thermal management via interfacial regulation of 3D network in BC/MXene films

  • 期刊论文

  • 发表日期：

    2026年2月28日

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  • Yi Zhang

摘要

Polymer-based thermally conductive composite materials are widely used in microelectronic heat dissipation and packaging. The interfacial thermal resistance (ITR) between fillers limits their in-plane thermal conductivity improvement. This study tailors interfacial heat transfer behavior through microstructure design. Nickel nanoparticles were in-situ reduced and anchored on boron nitride nanosheets (BNNS) via an in-situ reduction method, forming a “point-to-plane” contact interface in the BC/BNNS/MXene composite system to establish a continuous thermal conduction network. In this 3D network, uniformly dispersed MXene nanosheets are interconnected by Ni nanoparticles on BNNS, forming stable 3D heat transfer pathways. When the BS@Ni filler content was 10 wt%, the composite had a in-plane thermal conductivity of 13.8 W m− 1 K− 1, showing that Ni nanoparticles as thermal bridges reduce the contact thermal resistance between BNNS and MXene. As a thermal interface material for CPU cooling, the BM30BS@Ni10 composite film reduced the operating temperature from 84.5 °C to 69.9 °C. Under 80 mW·cm− 2 light irradiation, the film’s surface temperature quickly rose to 85 °C and maintained efficient photothermal conversion after ten cycles. This research offers an effective structural design strategy for high-performance polymer-based thermally conductive materials and has broad application prospects in electronic thermal management, intelligent heat regulation, and electromagnetic protection.