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<p>Polyimide (PI) is very popular in polymer film capacitors due to its excellent performance and easy film-forming properties. However, its relatively low dielectric constant (approximately 3–4) limits its application and development in the field of high-performance capacitors. In general, dielectric constant can be enhanced effectively by adding special filler materials into polyimide. In this study, core–shell structured C@SiC nanoparticles were synthesized via a hydrothermal method. Novel polyimide composites (C@SiC/PI) were obtained by dispersing C@SiC nanoparticles into polyamic acid, followed by thermal imidization. The dielectric constant of C@SiC/PI composite material is as high as 40.2, which is 11.4 times that of pure PI. The maximal discharging energy density reached up to 2.49&#xa0;J&#xa0;cm<sup>−3</sup> with 10% C@SiC nanoparticles, which is almost 3 times higher than pure PI under identical conditions. Additionally, the composites have excellent thermal stability with a decomposition temperature of 5% above 530℃. The tensile strength of the composite film is in the range of 89.7–130.50&#xa0;MPa, and the elongation at break is between 5.4% and 9.1%, maintaining good mechanical properties. Consequently, the fabricated composites hold significant promise for applications in polymer thin-film capacitors and flexible electronics.</p>

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Preparation and properties of high dielectric polyimide composite using a core–shell C@SiC filler

  • 期刊论文

  • 发表日期：

    2025年7月8日

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  • Huiping Liu,
  • Luyu Sui,
  • Shilei Luo,
  • Zixin Wang,
  • Meng Xu,
  • Ming Zhong,
  • Haoqing Hou,
  • Xinwen Peng

摘要

Polyimide (PI) is very popular in polymer film capacitors due to its excellent performance and easy film-forming properties. However, its relatively low dielectric constant (approximately 3–4) limits its application and development in the field of high-performance capacitors. In general, dielectric constant can be enhanced effectively by adding special filler materials into polyimide. In this study, core–shell structured C@SiC nanoparticles were synthesized via a hydrothermal method. Novel polyimide composites (C@SiC/PI) were obtained by dispersing C@SiC nanoparticles into polyamic acid, followed by thermal imidization. The dielectric constant of C@SiC/PI composite material is as high as 40.2, which is 11.4 times that of pure PI. The maximal discharging energy density reached up to 2.49 J cm−3 with 10% C@SiC nanoparticles, which is almost 3 times higher than pure PI under identical conditions. Additionally, the composites have excellent thermal stability with a decomposition temperature of 5% above 530℃. The tensile strength of the composite film is in the range of 89.7–130.50 MPa, and the elongation at break is between 5.4% and 9.1%, maintaining good mechanical properties. Consequently, the fabricated composites hold significant promise for applications in polymer thin-film capacitors and flexible electronics.