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Silver doped boron nitride approach to improve the thermal conductivity of polyurethane composites

  • Shuangshuang Sun,
  • Yang Wu,
  • Yu Zhang,
  • Yue-Ming Sun,
  • Hongtao Lin,
  • Ming Wang,
  • Chuanzeng Wang,
  • Shuhai Chen

摘要

High thermal conductivity composites have attracted considerable attention due to their extensive applications in electronic devices. In the present work, we propose a novel strategy by employing boron nitride doped silver nanoparticles (BN-Ag) to improve the thermal conductivity of polyurethane composites. The BN-Ag composite was prepared by depositing silver nanoparticles (AgNPs) onto the surface of boron nitride (BN), facilitating cross-linking between adjacent BN sheets. Interestingly, despite the low concentration of AgNPs at just 2.5% (The proportion is determined by the quantity of BN, and the subsequent statement remains unchanged), their thermal conductivity of BN-Ag/PU is significant enhanced by approximately 184%, while maintaining excellent thermal stability and high resistivity. Meanwhile, to further augment the thermal conductivity, a more noticeable improvement up to 236% without compromising its superior insulation properties (5.03 × 1013 Ω · cm) was recorded by doping BN-Ag/PU with silver nanowires (BN-Ag@AgNP/PU).