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<p>The in-situ Cu-7.7Nb microcomposite (MC) wires have been studied at different drawing stages before and after intermediate annealing. It is demonstrated that both deformation and intermediate annealing of the MCs are accompanied by a noticeable change in the Nb/Cu interface density, which affects not only the strength, but also the electrical conductivity of the composite wire. The intermediate annealing temperature affects the conductivity of the wire at all stages of deformation that follow the annealing. The wire has the maximum conductivity after annealing at 800&#xa0;°C. Based on scanning and transmission electron microscopy data, dependences of the Nb filament thicknesses, their aspect ratios, and interface densities on the composite strain have been constructed. The change of the Nb filaments morphology under intermediate annealing is accompanied with a decrease in the Cu/Nb interface density, the latter being a factor responsible for the increase in composite conductivity under annealing. Conductivity increases with increasing annealing temperature. These differences are preserved throughout the entire deformation process up to the final wire diameter of 0.05&#xa0;mm.</p>

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Effect of Structure Evolution of Cu-7.7%Nb Microcomposite Under Deformation on the Electrical Conductivity of Composite Wire

  • 期刊论文

  • 发表日期：

    2025年12月26日

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  • Irina Deryagina,
  • Elena Popova,
  • Evgeny Patrakov,
  • Maria Polikarpova,
  • Viktor Pantsyrny

摘要

The in-situ Cu-7.7Nb microcomposite (MC) wires have been studied at different drawing stages before and after intermediate annealing. It is demonstrated that both deformation and intermediate annealing of the MCs are accompanied by a noticeable change in the Nb/Cu interface density, which affects not only the strength, but also the electrical conductivity of the composite wire. The intermediate annealing temperature affects the conductivity of the wire at all stages of deformation that follow the annealing. The wire has the maximum conductivity after annealing at 800 °C. Based on scanning and transmission electron microscopy data, dependences of the Nb filament thicknesses, their aspect ratios, and interface densities on the composite strain have been constructed. The change of the Nb filaments morphology under intermediate annealing is accompanied with a decrease in the Cu/Nb interface density, the latter being a factor responsible for the increase in composite conductivity under annealing. Conductivity increases with increasing annealing temperature. These differences are preserved throughout the entire deformation process up to the final wire diameter of 0.05 mm.