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<p>REBCO high-temperature superconducting tapes are widely used in high-field applications due to their advantages of large critical current density, high upper critical magnetic field, and high critical temperature. However, due to their layered structure, REBCO tapes are susceptible to various mechanical loads, including but not limited to torsional loads, in practical applications such as preparing cables or magnets. To this end, we developed a critical performance measurement device for REBCO tapes under torsional load. The critical current (<i>I</i><sub><i>C</i></sub>) degradation characteristics of REBCO tapes fabricated by Shanghai Superconductor Technology Co., Ltd (SSTC) with different structures under torsional load were studied. Several samples were measured to analyze the influence of the substrate thickness, copper layer thickness, and copper lamination thickness of REBCO tapes on the <i>I</i><sub><i>C</i></sub> degradation behavior. The results indicate that copper and copper lamination can provide significant protection for REBCO tapes under torsional loads.</p>

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Study on the Critical Performance Degradation of REBCO Tapes Under Torsional Load

  • 期刊论文

  • 发表日期：

    2025年7月22日

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  • Jingfeng Zhang,
  • Hongjun Ma,
  • Zuoguang Li,
  • Fang Liu,
  • Huajun Liu

摘要

REBCO high-temperature superconducting tapes are widely used in high-field applications due to their advantages of large critical current density, high upper critical magnetic field, and high critical temperature. However, due to their layered structure, REBCO tapes are susceptible to various mechanical loads, including but not limited to torsional loads, in practical applications such as preparing cables or magnets. To this end, we developed a critical performance measurement device for REBCO tapes under torsional load. The critical current (IC) degradation characteristics of REBCO tapes fabricated by Shanghai Superconductor Technology Co., Ltd (SSTC) with different structures under torsional load were studied. Several samples were measured to analyze the influence of the substrate thickness, copper layer thickness, and copper lamination thickness of REBCO tapes on the IC degradation behavior. The results indicate that copper and copper lamination can provide significant protection for REBCO tapes under torsional loads.