<p>In this work, network regulation and reactive flame-retardant reinforcement were integrated by introducing BBA (2,2’-diallyl bisphenol A) and TAIC (triallyl isocyanurate) to tailor the ene/Diels-Alder, together with HECP (hexakis(4-allyl-2-methoxyphenoxy)cyclotriphosphazene) to build a copolymerized P-N cyclomatrix network via melt blending and staged curing. The flame-retardant action is mainly attributed to the synergism of phosphorus-promoted condensed-phase charring/barrier formation and nitrogen-assisted release of inert volatiles that dilute combustible pyrolysis species, thereby suppressing heat and mass transfer. At 3–4 wt% HECP, the resin achieved a flexural strength of 140&#xa0;MPa and a T<sub>g</sub> of 179.4&#xa0;°C, while the dielectric constant/loss decreased to 2.60/0.007 and the characteristic breakdown strength increased to 29.70&#xa0;kV/mm. The flame-retardant performance was simultaneously improved, with LOI rising to 36.8%, UL-94 reaching V-0, and THR (Total Heat Release) decreased by 44.1% at 5 wt% HECP. Excessive HECP induced network heterogeneity due to self-ring-opening polymerization, leading to partial property regression. These results demonstrate a scalable route to multifunctional BMI insulating matrices for high-reliability electronic packaging.</p>

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Cyclomatrix Phosphazene Containing P-N Network Segments Based on Reaction of Eugenoxy-Substituted Cyclotriphosphazene with Bismaleimide; Flame-Retardancy and Dielectric Properties

  • Pengjie Wang,
  • Hang Xu,
  • Hean Liao,
  • Kefei Zhu,
  • Xiaorui Zhang,
  • Qiran Dai,
  • Chenhao Li,
  • Ling Weng,
  • Yu Feng,
  • Dong Yue,
  • Jialin Liu

摘要

In this work, network regulation and reactive flame-retardant reinforcement were integrated by introducing BBA (2,2’-diallyl bisphenol A) and TAIC (triallyl isocyanurate) to tailor the ene/Diels-Alder, together with HECP (hexakis(4-allyl-2-methoxyphenoxy)cyclotriphosphazene) to build a copolymerized P-N cyclomatrix network via melt blending and staged curing. The flame-retardant action is mainly attributed to the synergism of phosphorus-promoted condensed-phase charring/barrier formation and nitrogen-assisted release of inert volatiles that dilute combustible pyrolysis species, thereby suppressing heat and mass transfer. At 3–4 wt% HECP, the resin achieved a flexural strength of 140 MPa and a Tg of 179.4 °C, while the dielectric constant/loss decreased to 2.60/0.007 and the characteristic breakdown strength increased to 29.70 kV/mm. The flame-retardant performance was simultaneously improved, with LOI rising to 36.8%, UL-94 reaching V-0, and THR (Total Heat Release) decreased by 44.1% at 5 wt% HECP. Excessive HECP induced network heterogeneity due to self-ring-opening polymerization, leading to partial property regression. These results demonstrate a scalable route to multifunctional BMI insulating matrices for high-reliability electronic packaging.