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<p>To address the poor intrinsic thermal conductivity of epoxy resin (EP), this study proposes a surface modification strategy for spherical Al<sub>2</sub>O<sub>3</sub> fillers using γ-glycid oxypropyl trimethoxy silane (KH560) to improve interfacial compatibility and thermal conduction network formation within the EP matrix. The surface morphology and chemical structure of the modified Al<sub>2</sub>O<sub>3</sub> were systematically characterized using scanning electron microscopy, Fourier transform infrared spectroscopy, and X-ray diffraction. The effects of Al<sub>2</sub>O<sub>3</sub> fillers loading on the dielectric properties, thermal conductivity, and thermal stability of the Al<sub>2</sub>O<sub>3</sub>/EP composites were thoroughly investigated. Results demonstrate that the chemical grafting of KH560 significantly enhanced the interfacial adhesion between Al<sub>2</sub>O<sub>3</sub> and EP, effectively reducing interfacial phonon scattering. Mechanistic analysis revealed that the chemical bonding at the interface minimized defects, and the optimized spatial packing of spherical fillers synergistically improved the topological structure of the thermal conduction network. This work provides a dual-strategy framework—combining interfacial engineering and geometric control of fillers—for designing high-performance thermally conductive epoxy composites, offering critical insights for applications in electronic packaging and high-voltage electrical insulation systems.</p>

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Surface Modification of Spherical Alumina and Its Enhanced Thermal Conductivity in Epoxy Composites

  • 期刊论文

  • 发表日期：

    2025年12月9日

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  • Yuan Jia,
  • Chengli Wang,
  • Duo Wang,
  • Juxiang Yang,
  • Jinming Fan,
  • Beibei Li

摘要

To address the poor intrinsic thermal conductivity of epoxy resin (EP), this study proposes a surface modification strategy for spherical Al2O3 fillers using γ-glycid oxypropyl trimethoxy silane (KH560) to improve interfacial compatibility and thermal conduction network formation within the EP matrix. The surface morphology and chemical structure of the modified Al2O3 were systematically characterized using scanning electron microscopy, Fourier transform infrared spectroscopy, and X-ray diffraction. The effects of Al2O3 fillers loading on the dielectric properties, thermal conductivity, and thermal stability of the Al2O3/EP composites were thoroughly investigated. Results demonstrate that the chemical grafting of KH560 significantly enhanced the interfacial adhesion between Al2O3 and EP, effectively reducing interfacial phonon scattering. Mechanistic analysis revealed that the chemical bonding at the interface minimized defects, and the optimized spatial packing of spherical fillers synergistically improved the topological structure of the thermal conduction network. This work provides a dual-strategy framework—combining interfacial engineering and geometric control of fillers—for designing high-performance thermally conductive epoxy composites, offering critical insights for applications in electronic packaging and high-voltage electrical insulation systems.