<p>Shock-wave compaction of heterogeneous materials was carried out. Ceramic and metallic powders and compositions based on them were considered. The explosive compaction method allows obtaining unique properties from powders due to short-term exposure to high temperatures and pressures, which makes it indispensable for the creation of nanocrystalline and amorphous materials. Various compaction schemes, the advantages and limitations, as well as the influence of loading parameters on the density and homogeneity of samples are considered. Particular attention is paid to modeling the processes, studying the mechanical and microstructural properties of materials such as boron carbide (B<sub>4</sub>C), tungsten carbide (WC), aluminum oxide (Al<sub>2</sub>O<sub>3</sub>), metal powders (Al, Cu, W, Co), and their heterogeneous mixtures. Researchers emphasize the importance of optimizing loading regimes for obtaining strong, homogeneous materials with specified characteristics.</p>

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Shock-Wave Compaction of Heterogeneous Materials

  • A. E. Buzyurkin,
  • E. I. Kraus,
  • Ya. L. Luk’yanov

摘要

Shock-wave compaction of heterogeneous materials was carried out. Ceramic and metallic powders and compositions based on them were considered. The explosive compaction method allows obtaining unique properties from powders due to short-term exposure to high temperatures and pressures, which makes it indispensable for the creation of nanocrystalline and amorphous materials. Various compaction schemes, the advantages and limitations, as well as the influence of loading parameters on the density and homogeneity of samples are considered. Particular attention is paid to modeling the processes, studying the mechanical and microstructural properties of materials such as boron carbide (B4C), tungsten carbide (WC), aluminum oxide (Al2O3), metal powders (Al, Cu, W, Co), and their heterogeneous mixtures. Researchers emphasize the importance of optimizing loading regimes for obtaining strong, homogeneous materials with specified characteristics.