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<p>A scalable two-step fabrication process for flexible MgB₂ superconducting tapes has been developed, combining magnetron co-sputtering with vacuum annealing (patent RU 2849051). The architecture employs Hastelloy® C-276™ substrates with buffer layers, a ~100 nm Nb layer serving as a protective cap to prevent oxidation and interdiffusion, and a ~100 nm Cu layer for thermal stabilization. Despite the absence of detectable MgB₂ phase signatures in X-ray diffraction—likely due to signal masking by the substrate and buffer layers—transport measurements confirm superconductivity with a critical temperature of 22 K and a critical current density of 2 MA/cm<sup>2</sup> at 5 K in self-field. Current limitations include suboptimal <i>T</i><sub>c</sub>, thin superconducting layers, and insufficient phase purity. Future efforts will focus on increasing film thickness, improving stoichiometry and crystallinity, and enhancing overall performance for practical applications.</p>

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Synthesis of MgB2 films on Hastelloy-C276 tape with Al2O3/Y2O3/MgO/LaMnO3 buffer layers followed by Nb protective layer and Cu stabilizing layer

  • 期刊论文

  • 发表日期：

    2026年7月31日

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  • Igor Yanilkin,
  • Amir Gumarov,
  • Denis Uvin,
  • Ruslan Batulin

摘要

A scalable two-step fabrication process for flexible MgB₂ superconducting tapes has been developed, combining magnetron co-sputtering with vacuum annealing (patent RU 2849051). The architecture employs Hastelloy® C-276™ substrates with buffer layers, a ~100 nm Nb layer serving as a protective cap to prevent oxidation and interdiffusion, and a ~100 nm Cu layer for thermal stabilization. Despite the absence of detectable MgB₂ phase signatures in X-ray diffraction—likely due to signal masking by the substrate and buffer layers—transport measurements confirm superconductivity with a critical temperature of 22 K and a critical current density of 2 MA/cm2 at 5 K in self-field. Current limitations include suboptimal Tc, thin superconducting layers, and insufficient phase purity. Future efforts will focus on increasing film thickness, improving stoichiometry and crystallinity, and enhancing overall performance for practical applications.