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<p>Lightweight metallic laminated composites with high electromagnetic interference (EMI) shielding effectiveness are highly desirable for applications in aerospace, electronic packaging, and portable electronic devices. However, simultaneously achieving low weight, reliable interfacial bonding, and excellent EMI shielding performance remains a significant challenge for dissimilar metallic laminates. In this work, Zn-interlayered Mg–Li alloy/silicon steel laminated composites were fabricated by combining chemical Zn plating, hot-dip galvanizing, and hot-press diffusion bonding. The effects of the interfacial microstructure and laminate architecture on the electrical conductivity and EMI shielding performance were systematically investigated. The results showed that a compact and continuous Zn-assisted bonding interface was obtained under the optimum processing conditions of 1.5&#xa0;min of hot-dip galvanizing and hot pressing at 460&#xa0;°C. SEM, EDS, and XRD analyses revealed diffusion-assisted interfacial bonding accompanied by the formation of limited Mg–Zn and Fe–Zn intermetallic compounds. Increasing the thickness of the Mg–Li alloy layer enhanced the electrical conductivity of the laminated composites, resulting in a maximum EMI shielding effectiveness of approximately 92&#xa0;dB at a laminate thickness of 5&#xa0;mm in the X-band (8.2–12.4&#xa0;GHz). The numerical simulation results were in good agreement with the experimental results. The enhanced EMI shielding performance is attributed to the synergistic effect of the highly conductive Mg–Li alloy layer and the continuous Zn-assisted interfacial transition layer, which together improve electrical continuity and promote electromagnetic wave reflection. This work provides an effective strategy for designing lightweight metallic laminated composites with robust interfacial bonding and excellent EMI shielding performance.</p>

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Fabrication, interfacial characterization, and electromagnetic shielding performance of Zn-interlayered Mg–Li alloy/silicon steel laminated composites

  • 期刊论文

  • 发表日期：

    2026年7月28日

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  • Lipeng Yang,
  • Dongxin Wang,
  • Wen Luo,
  • Xixue Mi,
  • Shuo Zhang,
  • Hailong Pang,
  • Zhaopeng Yang,
  • Shaopeng Wu

摘要

Lightweight metallic laminated composites with high electromagnetic interference (EMI) shielding effectiveness are highly desirable for applications in aerospace, electronic packaging, and portable electronic devices. However, simultaneously achieving low weight, reliable interfacial bonding, and excellent EMI shielding performance remains a significant challenge for dissimilar metallic laminates. In this work, Zn-interlayered Mg–Li alloy/silicon steel laminated composites were fabricated by combining chemical Zn plating, hot-dip galvanizing, and hot-press diffusion bonding. The effects of the interfacial microstructure and laminate architecture on the electrical conductivity and EMI shielding performance were systematically investigated. The results showed that a compact and continuous Zn-assisted bonding interface was obtained under the optimum processing conditions of 1.5 min of hot-dip galvanizing and hot pressing at 460 °C. SEM, EDS, and XRD analyses revealed diffusion-assisted interfacial bonding accompanied by the formation of limited Mg–Zn and Fe–Zn intermetallic compounds. Increasing the thickness of the Mg–Li alloy layer enhanced the electrical conductivity of the laminated composites, resulting in a maximum EMI shielding effectiveness of approximately 92 dB at a laminate thickness of 5 mm in the X-band (8.2–12.4 GHz). The numerical simulation results were in good agreement with the experimental results. The enhanced EMI shielding performance is attributed to the synergistic effect of the highly conductive Mg–Li alloy layer and the continuous Zn-assisted interfacial transition layer, which together improve electrical continuity and promote electromagnetic wave reflection. This work provides an effective strategy for designing lightweight metallic laminated composites with robust interfacial bonding and excellent EMI shielding performance.