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<p>Manufacture of high-density interconnect printed circuit board has put forward an urgent demand for high-performance Cu-based pastes. Cu nanoparticle (NP) pastes show high sintering activity, while confronting with oxidation risks, especially in long-term. In this work, polyamines are verified as effective additives to improve oxidation resistance of the Cu NP pastes in a long time, which yield high bonding performance. Among the investigated polyamines, triethylenetetramine (TETA) demonstrates the most outstanding anti-oxidation ability, which is valid over a period of 130&#xa0;days. Ethylene glycol is the most suitable solvent for the polyamine-involved pastes, and the bonding performance can be enhanced by increasing the sintering temperature. TETA-involved Cu NP pastes show the highest sintering extent, yielding coarser ligament size and denser structure, which leads to high shear strength of 61.93&#xa0;MPa, low electrical resistivity of 11.99 μΩ∙cm and high thermal conductivity of 76.2 W/(m∙K) by sintering at a temperature of 220&#xa0;°C and a pressure of 6&#xa0;MPa. This work proposes a strategy of obtaining Cu NP pastes with excellent long-term oxidation resistance and sintering performance through the addition of polyamines.</p>

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Polyamine-induced oxidation-resistant Cu nanoparticle pastes for high-performance Cu-Cu bonding

  • 期刊论文

  • 发表日期：

    2026年7月20日

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  • Yue Liao,
  • Hongjie Xu,
  • Yufeng Bai,
  • Benfang He,
  • Yupan Zhang,
  • Songya Feng,
  • Anxin Gao,
  • Yongda Zhao,
  • Zhiyong Xue

摘要

Manufacture of high-density interconnect printed circuit board has put forward an urgent demand for high-performance Cu-based pastes. Cu nanoparticle (NP) pastes show high sintering activity, while confronting with oxidation risks, especially in long-term. In this work, polyamines are verified as effective additives to improve oxidation resistance of the Cu NP pastes in a long time, which yield high bonding performance. Among the investigated polyamines, triethylenetetramine (TETA) demonstrates the most outstanding anti-oxidation ability, which is valid over a period of 130 days. Ethylene glycol is the most suitable solvent for the polyamine-involved pastes, and the bonding performance can be enhanced by increasing the sintering temperature. TETA-involved Cu NP pastes show the highest sintering extent, yielding coarser ligament size and denser structure, which leads to high shear strength of 61.93 MPa, low electrical resistivity of 11.99 μΩ∙cm and high thermal conductivity of 76.2 W/(m∙K) by sintering at a temperature of 220 °C and a pressure of 6 MPa. This work proposes a strategy of obtaining Cu NP pastes with excellent long-term oxidation resistance and sintering performance through the addition of polyamines.