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<p>Al/Al–70Si laminated composites (50&#xa0;wt% Si) were fabricated via vacuum hot-pressing using alternating Al powder layers and Al–70Si alloy sheets. The influence of layer thickness on microstructure, mechanical, and thermophysical properties was investigated. The results show that robust metallurgical bonding was achieved in the composites. The thinner laminates (0.4&#xa0;mm Al–70Si) exhibited superior flexural strengths (up to 368&#xa0;MPa) and increased fracture strain compared to the monolithic Al–50Si alloy. This simultaneous enhancement in strength and toughness is primarily attributed to a pronounced crack deflection mechanism, which effectively mitigates the inherent brittleness of the Si phase. Additionally, the laminated architecture ensures a well-matched coefficient of thermal expansion for electronic substrates and substantially improved thermal conductivity. This study offers an efficient strategy to bypass the strength–ductility trade-off in high-Si Al alloys and overcomes the processing limitations of conventional laminated rolling.</p>

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Overcoming the brittleness of high-Si Al alloys via laminated structure: microstructure, fracture behavior, and thermophysical properties

  • 期刊论文

  • 发表日期：

    2026年7月10日

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  • Wu Zixin,
  • Han Qian,
  • Chen Nan,
  • Yan Hao,
  • He Yifeng,
  • Peng Xiang,
  • Wang Richu,
  • Cai Zhiyong

摘要

Al/Al–70Si laminated composites (50 wt% Si) were fabricated via vacuum hot-pressing using alternating Al powder layers and Al–70Si alloy sheets. The influence of layer thickness on microstructure, mechanical, and thermophysical properties was investigated. The results show that robust metallurgical bonding was achieved in the composites. The thinner laminates (0.4 mm Al–70Si) exhibited superior flexural strengths (up to 368 MPa) and increased fracture strain compared to the monolithic Al–50Si alloy. This simultaneous enhancement in strength and toughness is primarily attributed to a pronounced crack deflection mechanism, which effectively mitigates the inherent brittleness of the Si phase. Additionally, the laminated architecture ensures a well-matched coefficient of thermal expansion for electronic substrates and substantially improved thermal conductivity. This study offers an efficient strategy to bypass the strength–ductility trade-off in high-Si Al alloys and overcomes the processing limitations of conventional laminated rolling.