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<p>Conductive aramid fibers are increasingly needed for flexible and wearable electronic applications. However, achieving effective metallization on aramid III remains challenging due to the lack of facile, mild, and scalable surface activation strategies and the insufficient chemical reactivity for metal nucleation and adhesion between modified surface and metal layer. Here, we report a simple synergistic strategy combining Friedel–Crafts (FC) alkylation to graft active sites in an AlCl₃-anhydrous ethanol system with a two-step copper deposition process. The fibers were first activated using a Cu(OAc)₂-NaBH₄ system, followed by electroless copper plating in a solution containing CuSO₄ as the copper source, dimethylamine borane (DMAB) as the reducing agent, EDTA·2Na and triethylamine (TEA) as complexing agents. This modification effectively grafted the fiber surface, introducing active sites that facilitate uniform, compact, and strongly adhered copper coatings. The FCM-5 fibers (5&#xa0;mL ECH) exhibited a weight gain of 192.01% and a surface resistance of 2.96 mΩ, while the FCMF-20 fabric (20&#xa0;mL ECH) gave an EMI SE of 47.3&#xa0;dB. These results demonstrate the efficiency of the proposed route, which holds great potential for practical applications in flexible wearable electronics and EMI shielding due to its facile preparation, mild reaction conditions, and excellent comprehensive performance.</p>

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Optimized Friedel–Crafts alkylation and electroless copper plating for high-conductivity Aramid III fibers with dense copper coating

  • 期刊论文

  • 发表日期：

    2026年5月22日

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  • Haoxiang Yang,
  • Zhicheng Li,
  • Lingfeng Kong,
  • Yi Wang,
  • Youfeng Jiang,
  • Yanxi Lei,
  • Yuxin Deng,
  • Pengcheng Tang,
  • Yanhui Luo,
  • Yan Sun,
  • Liang Geng

摘要

Conductive aramid fibers are increasingly needed for flexible and wearable electronic applications. However, achieving effective metallization on aramid III remains challenging due to the lack of facile, mild, and scalable surface activation strategies and the insufficient chemical reactivity for metal nucleation and adhesion between modified surface and metal layer. Here, we report a simple synergistic strategy combining Friedel–Crafts (FC) alkylation to graft active sites in an AlCl₃-anhydrous ethanol system with a two-step copper deposition process. The fibers were first activated using a Cu(OAc)₂-NaBH₄ system, followed by electroless copper plating in a solution containing CuSO₄ as the copper source, dimethylamine borane (DMAB) as the reducing agent, EDTA·2Na and triethylamine (TEA) as complexing agents. This modification effectively grafted the fiber surface, introducing active sites that facilitate uniform, compact, and strongly adhered copper coatings. The FCM-5 fibers (5 mL ECH) exhibited a weight gain of 192.01% and a surface resistance of 2.96 mΩ, while the FCMF-20 fabric (20 mL ECH) gave an EMI SE of 47.3 dB. These results demonstrate the efficiency of the proposed route, which holds great potential for practical applications in flexible wearable electronics and EMI shielding due to its facile preparation, mild reaction conditions, and excellent comprehensive performance.