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<p>Metallization on transparent conductive oxide (TCO) films constitutes a pivotal process in the fabrication of various high-performance optoelectronic devices. In SHJ solar cells, cost reduction through copper plating (electroless or electroplating) to replace silver paste introduces critical challenges in patterning, adhesion, and long-term reliability on TCO surfaces. This review presents a systematic overview of the latest developments in TCO metallization, with a particular emphasis on its applications within SHJ solar cell technology. We systematically compare the fundamental principles, process innovations, and material strategies of both electroless plating and electroplating techniques for TCO metallization. Key challenges in interfacial engineering, selective deposition, and copper diffusion control are discussed in detail. Finally, the key challenges and future pathways toward reliable, low-cost TCO metallization are assessed, including its broader implications beyond photovoltaics.</p>

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Development and prospects of Ag-free electroplating on TCO for silicon heterojunction solar cells

  • 期刊论文

  • 发表日期：

    2026年5月24日

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  • Ruijie Zhang,
  • Xianli Huang,
  • Houfang Teng,
  • Yunfei Miao,
  • Yihong Ren,
  • Tao Wang,
  • Jianping He

摘要

Metallization on transparent conductive oxide (TCO) films constitutes a pivotal process in the fabrication of various high-performance optoelectronic devices. In SHJ solar cells, cost reduction through copper plating (electroless or electroplating) to replace silver paste introduces critical challenges in patterning, adhesion, and long-term reliability on TCO surfaces. This review presents a systematic overview of the latest developments in TCO metallization, with a particular emphasis on its applications within SHJ solar cell technology. We systematically compare the fundamental principles, process innovations, and material strategies of both electroless plating and electroplating techniques for TCO metallization. Key challenges in interfacial engineering, selective deposition, and copper diffusion control are discussed in detail. Finally, the key challenges and future pathways toward reliable, low-cost TCO metallization are assessed, including its broader implications beyond photovoltaics.