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<p>To address the pressing challenge of achieving both low-temperature sintering and cost efficiency in next-generation HJT photovoltaic technologies, this work reports a hierarchically engineered silver powder. By systematically comparing the electrical transport properties and sintering kinetics of three representative silver powders over a wide temperature range, the superior performance of the newly developed hierarchical powder is demonstrated. This hierarchical structure comprises nanoscale surface protrusions firmly anchored on a submicron particle framework. This strategy integrates the high tap density of silver microparticles with the low-temperature sintering activity of silver nanoparticles, which has traditionally been difficult to achieve at the industrial scale. This dual-scale architecture enables the formation of highly conductive networks under reduced thermal budgets: at 200&#xa0;°C for 60&#xa0;min the paste achieves an ultralow resistivity of 9 × 10<sup>−6</sup>Ω·cm. Moreover, by judiciously tailoring the sintering time–temperature profile, the adhesive strength of the sintered layer can be significantly enhanced, while avoiding thermal-stress-induced degradation at excessive conditions. The results establish a scalable and industry-ready strategy for low-temperature, high-performance silver pastes, providing a transformative materials platform for high-efficiency photovoltaic cell interconnects and other emerging large-area electronic packaging technologies.</p>

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Hierarchically structured nano silver powder with dual-scale architecture enabling low-temperature high-conductivity photovoltaic pastes

  • 期刊论文

  • 发表日期：

    2026年5月18日

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  • Jinhua Qin,
  • Chenhe Zhang,
  • Jin Yang,
  • Zhe Huang,
  • Yunzhu Ma,
  • Wensheng Liu,
  • Siwei Tang

摘要

To address the pressing challenge of achieving both low-temperature sintering and cost efficiency in next-generation HJT photovoltaic technologies, this work reports a hierarchically engineered silver powder. By systematically comparing the electrical transport properties and sintering kinetics of three representative silver powders over a wide temperature range, the superior performance of the newly developed hierarchical powder is demonstrated. This hierarchical structure comprises nanoscale surface protrusions firmly anchored on a submicron particle framework. This strategy integrates the high tap density of silver microparticles with the low-temperature sintering activity of silver nanoparticles, which has traditionally been difficult to achieve at the industrial scale. This dual-scale architecture enables the formation of highly conductive networks under reduced thermal budgets: at 200 °C for 60 min the paste achieves an ultralow resistivity of 9 × 10−6Ω·cm. Moreover, by judiciously tailoring the sintering time–temperature profile, the adhesive strength of the sintered layer can be significantly enhanced, while avoiding thermal-stress-induced degradation at excessive conditions. The results establish a scalable and industry-ready strategy for low-temperature, high-performance silver pastes, providing a transformative materials platform for high-efficiency photovoltaic cell interconnects and other emerging large-area electronic packaging technologies.