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<p>The rapid evolution of millimeter-wave (mmWave) communication technologies demands advanced polymer composite substrates with ultralow dielectric constants (<i>ε</i><sub><i>r</i></sub>) and minimal dielectric loss (tan<i>δ</i>) to enable high-speed, low-latency signal transmission. In this study, high-density polyethylene (HDPE) composites incorporating hollow glass microspheres (HGM) at various filler loadings were fabricated and systematically evaluated for high-frequency substrate applications. The composites exhibited an ultralow dielectric constant (&lt; 2) and low dielectric loss in the mmWave frequency range. Composites with filler loadings of 10, 20, 30, 40, and 50 wt% were prepared, with three samples per composition. At the optimal loading of 30 wt%, the composite achieved a dielectric constant of 1.52 and a loss tangent of 0.015 at 60&#xa0;GHz, as measured using a vector network analyzer. Notably, no previously reported polymer-based substrate has demonstrated a dielectric constant below 2 at this frequency, highlighting the novelty of this work. The coefficient of thermal expansion of the 30 wt% composite was 33.31&#xa0;ppm/°C, indicating improved dimensional stability. The temperature coefficient of the dielectric constant was 31.44&#xa0;ppm/°C, confirming stable dielectric performance under thermal variations. The dielectric breakdown strength of the optimal sample was 7.24&#xa0;kV/mm, measured in accordance with IPC-TM-650 2.5.6, demonstrating adequate electrical insulation capability. Water absorption and porosity analyses indicated good structural integrity, while TGA–DSC results confirmed thermal stability for elevated-temperature applications. Overall, HGM-reinforced HDPE composites show strong potential as next-generation ultralow-dielectric substrates for mmWave electronics.</p>

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Unprecedented dielectric minimization in polymer composite: a novel ultra-low dielectric constant, polymer composite substrate for millimeter-wave circuit applications

  • 期刊论文

  • 发表日期：

    2026年5月19日

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  • Arun Nelliparambil Sathian,
  • Nikhil Kumar,
  • K. P. Murali

摘要

The rapid evolution of millimeter-wave (mmWave) communication technologies demands advanced polymer composite substrates with ultralow dielectric constants (εr) and minimal dielectric loss (tanδ) to enable high-speed, low-latency signal transmission. In this study, high-density polyethylene (HDPE) composites incorporating hollow glass microspheres (HGM) at various filler loadings were fabricated and systematically evaluated for high-frequency substrate applications. The composites exhibited an ultralow dielectric constant (< 2) and low dielectric loss in the mmWave frequency range. Composites with filler loadings of 10, 20, 30, 40, and 50 wt% were prepared, with three samples per composition. At the optimal loading of 30 wt%, the composite achieved a dielectric constant of 1.52 and a loss tangent of 0.015 at 60 GHz, as measured using a vector network analyzer. Notably, no previously reported polymer-based substrate has demonstrated a dielectric constant below 2 at this frequency, highlighting the novelty of this work. The coefficient of thermal expansion of the 30 wt% composite was 33.31 ppm/°C, indicating improved dimensional stability. The temperature coefficient of the dielectric constant was 31.44 ppm/°C, confirming stable dielectric performance under thermal variations. The dielectric breakdown strength of the optimal sample was 7.24 kV/mm, measured in accordance with IPC-TM-650 2.5.6, demonstrating adequate electrical insulation capability. Water absorption and porosity analyses indicated good structural integrity, while TGA–DSC results confirmed thermal stability for elevated-temperature applications. Overall, HGM-reinforced HDPE composites show strong potential as next-generation ultralow-dielectric substrates for mmWave electronics.