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<p>In the 5G-driven era of miniaturisation and high integration of electronic products, electromagnetic radiation pollution and heat accumulation have gradually evolved into core threats, not only damaging the precision and shortening the service life of devices, but also posing a threat to human health. Traditional single-function materials can no longer meet the needs of next-generation smart devices, and the development of electromagnetic interference (EMI) shielding composites with integrated thermal management functions is urgent. However, existing research studies exhibit significant functional limitations, with relatively few systematic discussions on dual-function composite materials integrating thermal management and electromagnetic shielding. Therefore, this paper begins with the fundamental mechanisms of electromagnetic shielding and thermal conductivity, briefly introducing dual-function fillers, including ceramic-based fillers, metal-based fillers, carbon-based fillers, and two-dimensional transition metal carbonitrides. Additionally, the structural design of bifunctional heat management electromagnetic shielding materials, including porous, multilayer, core–shell, and Janus structures, is reviewed. Finally, the challenges of EMI shielding materials with integrated thermal management are briefly discussed, aiming to provide valuable insights into their future development and potential applications in other specialised areas.</p>

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Electromagnetic shielding composites with thermal management function: research progress

  • 期刊论文

  • 发表日期：

    2026年5月7日

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  • Yuan-Yuan Hu,
  • Hao-Kai Peng,
  • Jinlong Zhou,
  • Xianjin Hu,
  • Qiuguo Liu,
  • Ting-Ting Li,
  • Jia-Horng Lin

摘要

In the 5G-driven era of miniaturisation and high integration of electronic products, electromagnetic radiation pollution and heat accumulation have gradually evolved into core threats, not only damaging the precision and shortening the service life of devices, but also posing a threat to human health. Traditional single-function materials can no longer meet the needs of next-generation smart devices, and the development of electromagnetic interference (EMI) shielding composites with integrated thermal management functions is urgent. However, existing research studies exhibit significant functional limitations, with relatively few systematic discussions on dual-function composite materials integrating thermal management and electromagnetic shielding. Therefore, this paper begins with the fundamental mechanisms of electromagnetic shielding and thermal conductivity, briefly introducing dual-function fillers, including ceramic-based fillers, metal-based fillers, carbon-based fillers, and two-dimensional transition metal carbonitrides. Additionally, the structural design of bifunctional heat management electromagnetic shielding materials, including porous, multilayer, core–shell, and Janus structures, is reviewed. Finally, the challenges of EMI shielding materials with integrated thermal management are briefly discussed, aiming to provide valuable insights into their future development and potential applications in other specialised areas.