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<p>Sn96.5%Ag3%Cu0.5% (SAC305) alloy is widely used as lead-free solder as interconnection in electronic devices which are operate in harsh environments. During the operation of electronic interconnects such as in well drilling the solder joint interconnects will face extreme environment. Solder joints exposed to very high temperatures that can reach up to 200&#xa0;°C and salty conditions. Microstructure response of lead-free solders depends on the process parameters and on the operating conditions like presence of salty water, high-temperature environments and moisture. This study investigate the effects of storage (aging) at elevated temperature and corrosion on SAC305 as a function of microstructure characterization. The corrosion effects evaluated in NaCl solution at 25&#xa0;°C, solder joints were immersed at different exposure times in solution of NaCl with concentration 3.5 wt.%. Scanning Electron Microscope and optical microscope used to analyze the microstructure of Sn grain morphology. The elemental distribution confirmed by Energy Dispersive Spectroscopy. It was found that the microstructure of SAC305 solder alloy changes significantly due to aging and due to the corrosion effect.</p>

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The impact of high-temperature aging and corrosion on the microstructure and mechanical behavior of SAC305 solder joints

  • 期刊论文

  • 发表日期：

    2026年3月14日

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  • Mohammed Genanu,
  • Ehsan H. Sabbar,
  • Amer K. Aljumaili,
  • Yahya R. Hathal,
  • Mohammed J. AlSultani

摘要

Sn96.5%Ag3%Cu0.5% (SAC305) alloy is widely used as lead-free solder as interconnection in electronic devices which are operate in harsh environments. During the operation of electronic interconnects such as in well drilling the solder joint interconnects will face extreme environment. Solder joints exposed to very high temperatures that can reach up to 200 °C and salty conditions. Microstructure response of lead-free solders depends on the process parameters and on the operating conditions like presence of salty water, high-temperature environments and moisture. This study investigate the effects of storage (aging) at elevated temperature and corrosion on SAC305 as a function of microstructure characterization. The corrosion effects evaluated in NaCl solution at 25 °C, solder joints were immersed at different exposure times in solution of NaCl with concentration 3.5 wt.%. Scanning Electron Microscope and optical microscope used to analyze the microstructure of Sn grain morphology. The elemental distribution confirmed by Energy Dispersive Spectroscopy. It was found that the microstructure of SAC305 solder alloy changes significantly due to aging and due to the corrosion effect.