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<p>Epoxy molding compounds (EMC) are widely used to encapsulate electronic products due to their good thermomechanical properties from external environmental protection. However, when EMC is exposed to high temperature, the oxidation effect plays an important role, and further aging may cause the degradation of its mechanical properties. In the study, EMC contains two types of filler content, one is 83% and the other is 87.8%. In terms of aging temperature, the study mainly discusses two temperatures (150 and 175&#xa0;°C), which are commonly used in packaging assembly processes. In addition, for aging time, the study conducts from 0 to 1008&#xa0;h. Later, the study is targeted to characterize EMCs’ thermomechanical, mechanical, and physical properties to understand the oxidation layer growth, glass transition temperature (T<sub>g</sub>), storage modulus, flexural stress, hardness, coefficient of thermal expansion (CTE), and composition analysis. Overall, the results indicate that with the increase of temperature or aging time, T<sub>g</sub>, storage modulus, and hardness will gradually increase, whereas CTE2 and toughness decrease steadily. Lastly, with higher filler content, EMC oxidation resistance turns out to be better.</p>

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Thermomechanical, mechanical, and physical characterization study of epoxy molding compound of memory packages under high-temperature aging

  • 期刊论文

  • 发表日期：

    2026年3月18日

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  • Vance Liu,
  • Yun-Ying Chen,
  • Yi-Ting Tsai,
  • Lu-Fu Lin,
  • Min-Hua Chung,
  • Chien-Ming Chen,
  • Chong Leong Gan,
  • Jenn-Ming Song

摘要

Epoxy molding compounds (EMC) are widely used to encapsulate electronic products due to their good thermomechanical properties from external environmental protection. However, when EMC is exposed to high temperature, the oxidation effect plays an important role, and further aging may cause the degradation of its mechanical properties. In the study, EMC contains two types of filler content, one is 83% and the other is 87.8%. In terms of aging temperature, the study mainly discusses two temperatures (150 and 175 °C), which are commonly used in packaging assembly processes. In addition, for aging time, the study conducts from 0 to 1008 h. Later, the study is targeted to characterize EMCs’ thermomechanical, mechanical, and physical properties to understand the oxidation layer growth, glass transition temperature (Tg), storage modulus, flexural stress, hardness, coefficient of thermal expansion (CTE), and composition analysis. Overall, the results indicate that with the increase of temperature or aging time, Tg, storage modulus, and hardness will gradually increase, whereas CTE2 and toughness decrease steadily. Lastly, with higher filler content, EMC oxidation resistance turns out to be better.