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<p>Reinforced Bi-2223 superconducting tapes are promising candidates for high-field and cryogenic applications, yet their overall performance is often limited by interfacial degradation under the combined action of electrical, magnetic, thermal and mechanical loads. In this work, the interfacial mechanical properties of reinforced Bi-2223 tapes were improved by introducing controlled sub-micron roughness on stainless-steel laminations prior to soldering. Three typical roughness levels were prepared, and their effects on shear and peel resistance, solder wettability, interfacial electrical resistance, and defect evolution were examined. Increasing the roughness led to a clear enhancement in bonding quality: at 77&#xa0;K, the peel failure load increased by 144%, and the shear failure load increased by 12.5%. The improved performance is attributed to better solder wetting, reduced interfacial voids, and a larger effective bonding area, together with roughness-induced contact geometry that enhances load transfer capability. The structure–property relationships revealed in this study provide guidance for designing reinforced Bi-2223 conductors with improved mechanical reliability, and offer a practical approach for strengthening the interfaces of multilayer superconducting systems.</p>

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Enhancement of interface mechanical properties in reinforced Bi-2223 superconducting tapes via controlled interface roughness

  • 期刊论文

  • 发表日期：

    2026年3月5日

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  • Lang Jiang,
  • Yanhong Bi,
  • Xueqian Liu,
  • Rui Zhang,
  • Jing Liu,
  • Xinsheng Yang,
  • Fang Yang,
  • Xiaobo Ma,
  • Jixing Liu,
  • Shengnan Zhang,
  • Jianfeng Li,
  • Pingxiang Zhang

摘要

Reinforced Bi-2223 superconducting tapes are promising candidates for high-field and cryogenic applications, yet their overall performance is often limited by interfacial degradation under the combined action of electrical, magnetic, thermal and mechanical loads. In this work, the interfacial mechanical properties of reinforced Bi-2223 tapes were improved by introducing controlled sub-micron roughness on stainless-steel laminations prior to soldering. Three typical roughness levels were prepared, and their effects on shear and peel resistance, solder wettability, interfacial electrical resistance, and defect evolution were examined. Increasing the roughness led to a clear enhancement in bonding quality: at 77 K, the peel failure load increased by 144%, and the shear failure load increased by 12.5%. The improved performance is attributed to better solder wetting, reduced interfacial voids, and a larger effective bonding area, together with roughness-induced contact geometry that enhances load transfer capability. The structure–property relationships revealed in this study provide guidance for designing reinforced Bi-2223 conductors with improved mechanical reliability, and offer a practical approach for strengthening the interfaces of multilayer superconducting systems.