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<p>The present work investigates the effect of indium (In) additions at 5 wt.% and 15 wt.% in Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloys. In has recently gained attention for its ability to lower-melting points. However, the effects of In additions on temperature-dependent phase transformations and lattice characteristics in SAC305 remain insufficiently understood. In this study, in-situ synchrotron XRD was used to characterize the temperature dependence of the lattice parameters of the β-Sn and γ-InSn₄ phases. Adding 5 wt.% and 15 wt.% In triggers significant microstructural changes. While the base SAC305 solder is mainly composed of β-Sn and eutectic Ag₃Sn and Cu₆Sn₅ phases, the 5 wt.% In addition notably promotes the emergence of a new Ag₉In₄ phase. The γ-InSn₄ phase dominates the microstructure, with β-Sn gradually disappearing and being replaced by γ-InSn₄ throughout the solder matrix for 15 wt.% In. Advanced in-situ XRD analysis shows that adding 5 wt.% In increases the β-Sn lattice parameters, as the larger In atoms dissolve substitutionally on Sn sites and thereby expand the lattice. Thermal analysis shows that In reduces both the liquidus temperature and undercooling of SAC305–xIn alloys, with the largest reduction observed for SAC305–15In. Mechanically, the addition of 5 wt.% In results in an ~ 50% increase in tensile strength, whereas a higher In content of 15 wt.% causes a substantial decrease in elongation, indicating a loss of ductility at excessive In levels. These findings emphasize the critical balance of In content required to optimise the performance of SAC305-based solder alloys.</p>

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The effects of indium on the microstructural evolution, lattice characteristics, thermal stability and mechanical performance in Sn-3.0Ag-0.5Cu solder alloys

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年1月19日

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  • N. S. Mohamad Zaimi,
  • M. A. A. Mohd Salleh,
  • Mohd Sharizal Abdul Aziz,
  • N. I. Muhammad Nadzri,
  • M. Zan Hazizi,
  • K. Kamonsuangkasem,
  • W. Tanthanuch,
  • S. Tancharakorn,
  • N. Mothong,
  • C. Y. Khor

摘要

The present work investigates the effect of indium (In) additions at 5 wt.% and 15 wt.% in Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloys. In has recently gained attention for its ability to lower-melting points. However, the effects of In additions on temperature-dependent phase transformations and lattice characteristics in SAC305 remain insufficiently understood. In this study, in-situ synchrotron XRD was used to characterize the temperature dependence of the lattice parameters of the β-Sn and γ-InSn₄ phases. Adding 5 wt.% and 15 wt.% In triggers significant microstructural changes. While the base SAC305 solder is mainly composed of β-Sn and eutectic Ag₃Sn and Cu₆Sn₅ phases, the 5 wt.% In addition notably promotes the emergence of a new Ag₉In₄ phase. The γ-InSn₄ phase dominates the microstructure, with β-Sn gradually disappearing and being replaced by γ-InSn₄ throughout the solder matrix for 15 wt.% In. Advanced in-situ XRD analysis shows that adding 5 wt.% In increases the β-Sn lattice parameters, as the larger In atoms dissolve substitutionally on Sn sites and thereby expand the lattice. Thermal analysis shows that In reduces both the liquidus temperature and undercooling of SAC305–xIn alloys, with the largest reduction observed for SAC305–15In. Mechanically, the addition of 5 wt.% In results in an ~ 50% increase in tensile strength, whereas a higher In content of 15 wt.% causes a substantial decrease in elongation, indicating a loss of ductility at excessive In levels. These findings emphasize the critical balance of In content required to optimise the performance of SAC305-based solder alloys.