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<p>Conductive silver pastes dominate electrode manufacturing in silicon heterojunction (SHJ) solar cells but suffer from high and volatile material costs. While silver-coated copper particles (Cu@Ag MPs) offer a promising low-cost alternative, conventional synthesis methods struggle to achieve uniform coatings, leading to poor oxidation stability and conductivity. Herein, we introduce a novel chloride-ion-assisted chemical reduction method to synthesize high-quality Cu@Ag MPs. The introduced Cl⁻ ions act as an electrostatic dispersant, effectively suppressing copper agglomeration and enabling the formation of a uniform and dense silver shell. The optimized Cu@Ag MPs (30 wt% Ag) exhibit excellent oxidation resistance below 300&#xa0;°C and a low resistivity of 1.90 mΩ. When formulated into a low-temperature curing paste for SHJ solar cells, the composite ink achieves a volume resistivity of 8.22 × 10<sup>–6</sup> Ω·cm after curing at 210&#xa0;°C. Remarkably, the paste demonstrates outstanding environmental stability, with only 1% resistivity degradation after 30&#xa0;days of ambient exposure. This work presents a viable and cost-effective solution for photovoltaic metallization, reducing silver consumption by 70% while maintaining performance parity with commercial pastes, thereby paving the way for more sustainable solar cell manufacturing.</p>

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High-performance low-cost silver-coated copper paste for silicon heterojunction solar cells

  • 期刊论文

  • 发表日期：

    2026年1月20日

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  • Zhe Tang,
  • Hongyu Li,
  • Zhen-guo Liu,
  • Peng-an Zong

摘要

Conductive silver pastes dominate electrode manufacturing in silicon heterojunction (SHJ) solar cells but suffer from high and volatile material costs. While silver-coated copper particles (Cu@Ag MPs) offer a promising low-cost alternative, conventional synthesis methods struggle to achieve uniform coatings, leading to poor oxidation stability and conductivity. Herein, we introduce a novel chloride-ion-assisted chemical reduction method to synthesize high-quality Cu@Ag MPs. The introduced Cl⁻ ions act as an electrostatic dispersant, effectively suppressing copper agglomeration and enabling the formation of a uniform and dense silver shell. The optimized Cu@Ag MPs (30 wt% Ag) exhibit excellent oxidation resistance below 300 °C and a low resistivity of 1.90 mΩ. When formulated into a low-temperature curing paste for SHJ solar cells, the composite ink achieves a volume resistivity of 8.22 × 10–6 Ω·cm after curing at 210 °C. Remarkably, the paste demonstrates outstanding environmental stability, with only 1% resistivity degradation after 30 days of ambient exposure. This work presents a viable and cost-effective solution for photovoltaic metallization, reducing silver consumption by 70% while maintaining performance parity with commercial pastes, thereby paving the way for more sustainable solar cell manufacturing.