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<p>Herein, Ag@Ti₃SiC₂ core–shell powders were synthesized via a pretreatment-free electroless Ag plating method. When ascorbic acid was used as the reducing agent, with 0.1&#xa0;g PVP, 5&#xa0;mL ammonia, and a reaction temperature of 40&#xa0;°C, the Ag coverage reached 84.54%. Ag/Ti₃SiC₂ composite electrical contact materials (ECM), reinforced with Ag@Ti₃SiC₂ powders, were fabricated through powder metallurgy. The results revealed that electroless Ag plating on the surface of Ti₃SiC₂ particles effectively enhanced the overall performance of the material. Reinforced with Ag@Ti₃SiC₂, the hardness, relative density, and volumetric shrinkage of the composite material increased by 4.97 HV, 1.98%, and 0.46%, respectively, while the electrical resistivity decreased by 0.274 µΩ·cm, compared to the composite reinforced with Ti₃SiC₂.</p>

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Fabrication of Ag@Ti₃SiC₂ particles and its influence on the performance of Ag/Ti₃SiC₂ electrical contact materials

  • 期刊论文

  • 发表日期：

    2025年12月15日

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  • Xi Zhang,
  • Yong Zheng,
  • Zhao Li,
  • Lingling Chen

摘要

Herein, Ag@Ti₃SiC₂ core–shell powders were synthesized via a pretreatment-free electroless Ag plating method. When ascorbic acid was used as the reducing agent, with 0.1 g PVP, 5 mL ammonia, and a reaction temperature of 40 °C, the Ag coverage reached 84.54%. Ag/Ti₃SiC₂ composite electrical contact materials (ECM), reinforced with Ag@Ti₃SiC₂ powders, were fabricated through powder metallurgy. The results revealed that electroless Ag plating on the surface of Ti₃SiC₂ particles effectively enhanced the overall performance of the material. Reinforced with Ag@Ti₃SiC₂, the hardness, relative density, and volumetric shrinkage of the composite material increased by 4.97 HV, 1.98%, and 0.46%, respectively, while the electrical resistivity decreased by 0.274 µΩ·cm, compared to the composite reinforced with Ti₃SiC₂.