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<p>The microstructural evolution and shear strength of Cu/InZnSnBi/Cu joints bonded at a low temperature of 100&#xa0;°C for 10&#xa0;min under extremely low pressure of 0.0008&#xa0;MPa were investigated under accelerated thermal aging. Secondary InBi phases precipitated from the Sn-rich matrix during aging, leading to a refined solder microstructure. Concurrently, the interfacial intermetallic compound (IMC) Cu₅Zn₈ layer thickened progressively with a growth kinetic exponent of 1.249, while no additional IMC phases were detected throughout the aging process. Kirkendall voids accumulate along the IMC front, forming potential reliability concerns. These results demonstrate the feasibility of InZnSnBi as a low-temperature solder, offering refined microstructures and controlled interfacial reactions that are critical for reliable flexible electronic packaging.</p>

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Microstructural evolution and reliability of low-temperature InZnSnBi solder joints for flexible electronics

  • 期刊论文

  • 发表日期：

    2025年12月27日

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  • Wu Guodong,
  • Shen Jingfang,
  • Yang Li,
  • Muhammad Khairi Faiz,
  • Zhou Ding,
  • Wong Yew Hoong

摘要

The microstructural evolution and shear strength of Cu/InZnSnBi/Cu joints bonded at a low temperature of 100 °C for 10 min under extremely low pressure of 0.0008 MPa were investigated under accelerated thermal aging. Secondary InBi phases precipitated from the Sn-rich matrix during aging, leading to a refined solder microstructure. Concurrently, the interfacial intermetallic compound (IMC) Cu₅Zn₈ layer thickened progressively with a growth kinetic exponent of 1.249, while no additional IMC phases were detected throughout the aging process. Kirkendall voids accumulate along the IMC front, forming potential reliability concerns. These results demonstrate the feasibility of InZnSnBi as a low-temperature solder, offering refined microstructures and controlled interfacial reactions that are critical for reliable flexible electronic packaging.