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<p>The microstructure, mechanical performances, and wettability of Sn58Bi solder modified by different contents of Ag nanoparticles were investigated. Analysis revealed that the microstructure of Sn58Bi/Cu solder joint underwent refinement upon adding Ag nanoparticles. In addition, the growth of interfacial intermetallic compound (IMC) layer exhibited efficient suppression. With adding 1.0 wt% Ag nanoparticles, the thickness of IMC layer declined from original value of 1.189&#xa0;µm to 0.761&#xa0;µm. The results of shear testing characterized that Sn58Bi-1.0Ag/Cu solder joint displayed optimum shear strength, which reached 45.5&#xa0;MPa, achieving a 9.4% enhancement over unmodified Sn58Bi/Cu solder joint. Furthermore, adding 1.0 wt% Ag nanoparticles into Sn58Bi solder exhibited a peak spreading area of 70.46 mm<sup>2</sup>.</p>

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Influence of different contents of Ag nanoparticles on microstructure and properties of Sn58Bi/Cu solder joint

  • 期刊论文

  • 发表日期：

    2025年12月1日

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  • Wenhao Wang,
  • Lei Sun,
  • Peng He,
  • Minghe Chen,
  • Bingyang Guo

摘要

The microstructure, mechanical performances, and wettability of Sn58Bi solder modified by different contents of Ag nanoparticles were investigated. Analysis revealed that the microstructure of Sn58Bi/Cu solder joint underwent refinement upon adding Ag nanoparticles. In addition, the growth of interfacial intermetallic compound (IMC) layer exhibited efficient suppression. With adding 1.0 wt% Ag nanoparticles, the thickness of IMC layer declined from original value of 1.189 µm to 0.761 µm. The results of shear testing characterized that Sn58Bi-1.0Ag/Cu solder joint displayed optimum shear strength, which reached 45.5 MPa, achieving a 9.4% enhancement over unmodified Sn58Bi/Cu solder joint. Furthermore, adding 1.0 wt% Ag nanoparticles into Sn58Bi solder exhibited a peak spreading area of 70.46 mm2.