Study on shear properties of Cu–Sn full IMC graphene composite solder joints
摘要
In order to obtain the effect of graphene content on the shear properties of Cu–Sn full IMC graphene composite solder joints, Cu/IMC-xGNPs/Cu (x = 0.06, 0.18, 0.30, 0.42, 0.54wt.%) solder joints with different graphene contents were prepared. The shear properties of the solder joints were tested, the shear strength of the solder joints was obtained and the fracture morphology of the solder joints was analyzed. The results show that the shear strength of solder joints increases with the increase of graphene content. When the graphene content in the solder joint is 0.54wt%, the shear strength is 32.2% higher than that of the solder joint without graphene. The shear fracture analysis shows that with the increase of graphene content, the grain distribution in the solder joint is denser. The graphene is coated inside Cu6Sn5 or Cu3Sn to form an IMC-GNPs composite structure, which improves the shear strength of solder joints.