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<p>This study investigates the influence of incorporating liquid crystal epoxy resin monomer (LCER) and KH550-modified alumina filler (Al<sub>2</sub>O<sub>3</sub>) into epoxy resin on the thermal and electrical properties. First, a biphenyl-type LCER was synthesized using the epichlorohydrin method. Then, an Al<sub>2</sub>O<sub>3</sub>/LCER-E51 composite was made with KH550-modified Al<sub>2</sub>O<sub>3</sub> particles as the functional filler and LCER-E51 as the polymer matrix. The results indicate that using LCER-E51 as the matrix and grafting KH550 onto the surfaces of the Al<sub>2</sub>O<sub>3</sub> filler greatly increases the thermal conductivity of the composite. When the LCER content reaches 25%, the thermal conductivity of LCER-E51 increases to 0.342 W/(m&#xa0;K), which is double that of pure E51 epoxy resin. When KH550-modified Al<sub>2</sub>O<sub>3</sub> in LCER-E51 reaches 40%, thermal conductivity is 0.49 W/(m&#xa0;K), up 188.24% from pure E-51. The AC breakdown field strength of LCER-E51 is 70.72&#xa0;kV/mm at 15 wt.% LCER, representing an increase of 7.05% compared to pure E51, but decreases to 58.2&#xa0;kV/mm at 25 wt.% LCER. Compared to LCER-E51, it’s 72.26&#xa0;kV/mm at 10 wt% Al<sub>2</sub>O<sub>3</sub>, slightly higher, yet falls 12.4% at 40 wt% Al<sub>2</sub>O<sub>3</sub>. Pure E51 epoxy resin has a dielectric constant of 3.69 at low frequencies. At 25% LCER, LCER-E51’s dielectric constant rises to 3.83, increasing with LCER content. The loss factor of LCER-E51 increases with rising LCER content. In this study, the thermal conductivity and dielectric properties of E51 are enhanced through the approach of intrinsic modification using liquid crystal epoxy resin, in combination with Al<sub>2</sub>O<sub>3</sub> filler-based modification.</p>

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Investigation of thermal conductivity and electrical properties in alumina/liquid crystal epoxy composites

  • 期刊论文

  • 发表日期：

    2025年11月4日

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  • Wei Song,
  • Lipeng Zhu,
  • Lin Li,
  • Jingtao Feng,
  • Xiufeng Peng,
  • Mengmeng Gou,
  • Qingquan Lei

摘要

This study investigates the influence of incorporating liquid crystal epoxy resin monomer (LCER) and KH550-modified alumina filler (Al2O3) into epoxy resin on the thermal and electrical properties. First, a biphenyl-type LCER was synthesized using the epichlorohydrin method. Then, an Al2O3/LCER-E51 composite was made with KH550-modified Al2O3 particles as the functional filler and LCER-E51 as the polymer matrix. The results indicate that using LCER-E51 as the matrix and grafting KH550 onto the surfaces of the Al2O3 filler greatly increases the thermal conductivity of the composite. When the LCER content reaches 25%, the thermal conductivity of LCER-E51 increases to 0.342 W/(m K), which is double that of pure E51 epoxy resin. When KH550-modified Al2O3 in LCER-E51 reaches 40%, thermal conductivity is 0.49 W/(m K), up 188.24% from pure E-51. The AC breakdown field strength of LCER-E51 is 70.72 kV/mm at 15 wt.% LCER, representing an increase of 7.05% compared to pure E51, but decreases to 58.2 kV/mm at 25 wt.% LCER. Compared to LCER-E51, it’s 72.26 kV/mm at 10 wt% Al2O3, slightly higher, yet falls 12.4% at 40 wt% Al2O3. Pure E51 epoxy resin has a dielectric constant of 3.69 at low frequencies. At 25% LCER, LCER-E51’s dielectric constant rises to 3.83, increasing with LCER content. The loss factor of LCER-E51 increases with rising LCER content. In this study, the thermal conductivity and dielectric properties of E51 are enhanced through the approach of intrinsic modification using liquid crystal epoxy resin, in combination with Al2O3 filler-based modification.