<p>The growing environmental and health concerns associated with conventional Sn-Pb solder systems have accelerated the search for lead-free alternatives. In this context, low melting point high-entropy alloys (LMP-HEAs) have emerged as strong candidates to replace Sn-Pb-based systems in advanced soldering applications. This work investigated the Ga-In-Bi-Sn-Ag system as a promising LMP-HEA candidate through a combined theoretical and experimental approach aimed at identifying compositions with low melting points, good mechanical properties, high wettability, and enhanced corrosion resistance. Thermodynamic simulations using Thermo-Calc software assisted in the selection of four alloy compositions, minimizing experimental iterations. Experimental results showed strong agreement with predictions based on the thermodynamic calculations, validating the simulations for phase formation and thermal behavior. Structural and thermal characterizations revealed complex, multiphase microstructures predominantly composed of BiIn, β-Sn, and In-Sn phases, along with minor amounts of additional elemental or intermetallic phases. Differential scanning calorimetry indicated melting transitions below 90&#xa0;°C for all compositions except for the equiatomic alloy, which remained partially solid up to 240&#xa0;°C. Among the studied compositions, Ga₅In₃₀Bi₃₀Sn₃₀Ag₅ stands out as a promising candidate due to its refined and homogeneous microstructure, low melting point (84&#xa0;°C), the highest compressive strength (57.4 MPa), and compressive plastic behavior (&gt;100%). Additionally, the wettability tests on PDMS substrates demonstrated favorable spreading behavior, with a contact angle of 52° at 180&#xa0;°C for this alloy. Finally, for all alloys, corrosion tests in saline media revealed high corrosion resistance, outperforming commercial lead-free solders.</p>