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<p>To improve the inherent low mechanical properties and brittleness of Sn58Bi solder, which limits its application in high-performance electronic packaging, this study employed a ball milling method to prepare composite solders synergistically reinforced by carbon nanotubes (CNTs) and nickel nanoparticles (NiNPs). A systematic investigation was conducted on the microstructure, wettability, and intermetallic compound (IMC) of <i>x</i>CNTs-<i>y</i>NiNPs-Sn58Bi/Cu joints for <i>x</i>CNTs-<i>y</i>NiNPs-Sn58Bi (<i>x</i> = 0.01, 0.03, 0.05&#xa0;wt%; <i>y</i> = 0.3, 0.5, 0.9&#xa0;wt%). Results indicate that appropriate amounts of CNTs and NiNPs refine the solder microstructure and enhance joint properties. The composite solder with 0.03 wt% CNTs–0.3 wt% NiNPs exhibited optimal comprehensive performance: its microstructure was refined, and its Sn58Bi/Cu solder joint demonstrated the thinnest IMC thickness (0.96&#xa0;μm) and the best wettability (43.8°). The synergistic strengthening mechanism of CNTs and NiNPs primarily stems from providing heterogeneous nucleation sites and pinning grain boundaries to inhibit grain growth and refine the microstructure. The physical barrier effect of CNTs and NiNPs’ consumption of interfacial Sn atoms effectively suppressed IMC growth. The synergistic reduction of solid–liquid interfacial energy by CNTs and melt surface tension by NiNPs improved the solder’s wettability. In mechanical property testing, the shear strength (32.5&#xa0;MPa) of the 0.03 wt% CNTs–0.3 wt% NiNPs solder joint was slightly lower than the peak value (33.5&#xa0;MPa). This strengthening effect resulted from dispersion, grain refinement strengthening, load transfer via CNTs, and micro-bridging. The optimal composition is 0.03 wt% CNTs and 0.3 wt% NiNPs. This study reveals the synergistic strengthening mechanism of CNTs and NiNPs in Sn58Bi solder, providing new insights for developing high-reliability, low-temperature composite solders.</p>

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Microstructure and mechanical properties of Sn58Bi composite solder reinforced with carbon nanotubes and nano-nickel

  • 期刊论文

  • 发表日期：

    2025年11月3日

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  • JingLi Ke,
  • Min Shang,
  • ChenYu Li,
  • WenLong Yang,
  • JinWei Cao,
  • JiaJun Wang,
  • YunPeng Wang,
  • HaiTao Ma

摘要

To improve the inherent low mechanical properties and brittleness of Sn58Bi solder, which limits its application in high-performance electronic packaging, this study employed a ball milling method to prepare composite solders synergistically reinforced by carbon nanotubes (CNTs) and nickel nanoparticles (NiNPs). A systematic investigation was conducted on the microstructure, wettability, and intermetallic compound (IMC) of xCNTs-yNiNPs-Sn58Bi/Cu joints for xCNTs-yNiNPs-Sn58Bi (x = 0.01, 0.03, 0.05 wt%; y = 0.3, 0.5, 0.9 wt%). Results indicate that appropriate amounts of CNTs and NiNPs refine the solder microstructure and enhance joint properties. The composite solder with 0.03 wt% CNTs–0.3 wt% NiNPs exhibited optimal comprehensive performance: its microstructure was refined, and its Sn58Bi/Cu solder joint demonstrated the thinnest IMC thickness (0.96 μm) and the best wettability (43.8°). The synergistic strengthening mechanism of CNTs and NiNPs primarily stems from providing heterogeneous nucleation sites and pinning grain boundaries to inhibit grain growth and refine the microstructure. The physical barrier effect of CNTs and NiNPs’ consumption of interfacial Sn atoms effectively suppressed IMC growth. The synergistic reduction of solid–liquid interfacial energy by CNTs and melt surface tension by NiNPs improved the solder’s wettability. In mechanical property testing, the shear strength (32.5 MPa) of the 0.03 wt% CNTs–0.3 wt% NiNPs solder joint was slightly lower than the peak value (33.5 MPa). This strengthening effect resulted from dispersion, grain refinement strengthening, load transfer via CNTs, and micro-bridging. The optimal composition is 0.03 wt% CNTs and 0.3 wt% NiNPs. This study reveals the synergistic strengthening mechanism of CNTs and NiNPs in Sn58Bi solder, providing new insights for developing high-reliability, low-temperature composite solders.