Scholarlink

<p>This study investigated a SnBiIn low-melting-point solder doped with graphene nanosheets (GNSs). The melting behavior, wettability, microstructure, interfacial intermetallic compounds (IMCs), and tensile strength were systematically examined. Results indicated that the solder alloy exhibited a melting point of 85.09&#xa0;°C, which slightly decreased upon GNSs addition. The addition of 0.05&#xa0;wt% GNSs significantly improved the wettability of the solder alloy on the Cu substrate. The alloy microstructure was primarily composed of InBi IMCs and a Sn-rich phase. GNSs addition effectively refined the microstructure, with the average width of the InBi IMCs reaching a minimum of 5.12&#xa0;µm at 0.05&#xa0;wt% GNSs. At the SnBiIn-<i>x</i>GNSs/Cu solder joint interface, the IMC layer consisted of Cu<sub>6</sub> (Sn, In)<sub>5</sub>. The average tensile strength increased with GNSs incorporation, peaked at 0.05&#xa0;wt% GNSs, beyond which it decreased.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Microstructure and performance evolution of graphene-tailored SnBiIn low-melting-point solder alloy

  • 期刊论文

  • 发表日期：

    2025年10月25日

查看全文
  • Zheng Liu,
  • Haodong Wu,
  • Yang Zheng,
  • Yucong He,
  • Li Yang,
  • Qiusheng Lin,
  • Zhitao Zhang

摘要

This study investigated a SnBiIn low-melting-point solder doped with graphene nanosheets (GNSs). The melting behavior, wettability, microstructure, interfacial intermetallic compounds (IMCs), and tensile strength were systematically examined. Results indicated that the solder alloy exhibited a melting point of 85.09 °C, which slightly decreased upon GNSs addition. The addition of 0.05 wt% GNSs significantly improved the wettability of the solder alloy on the Cu substrate. The alloy microstructure was primarily composed of InBi IMCs and a Sn-rich phase. GNSs addition effectively refined the microstructure, with the average width of the InBi IMCs reaching a minimum of 5.12 µm at 0.05 wt% GNSs. At the SnBiIn-xGNSs/Cu solder joint interface, the IMC layer consisted of Cu6 (Sn, In)5. The average tensile strength increased with GNSs incorporation, peaked at 0.05 wt% GNSs, beyond which it decreased.