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<p>Lead-free alternatives to traditional tin–lead (Sn–Pb) solders are becoming increasingly important due to environmental and health concerns. In this study, alloys suitable for Surface Mount Technology (SMT) soldering were produced by adding copper (Cu), antimony (Sb), and zinc (Zn) to the Sn-10Bi (tin–bismuth) base alloy. The thermal conductivity, electrical conductivity, microstructure, microhardness, and tensile strength of Sn-10Bi-0.8Cu, Sn-10Bi-0.8Cu-1Zn, Sn-10Bi-5Sb, and Sn-10Bi-5Sb-1Zn were investigated. Sn-10Bi-0.8Cu exhibited the highest thermal and electrical conductivity at room temperature, with values ​​of 55.84 W/Km and 0.0869 × 10<sup>8</sup>/Ωm, respectively, while the Sn-10Bi-5Sb-1Zn alloy exhibited superior mechanical strength, with values ​​of 61.75 HV and 83.04&#xa0;MPa. Considering performance, cost, and reliability, Sn-10Bi-5Sb and Sn-10Bi-0.8Cu offer promise as practical, lead-free alternatives to Sn–Pb and SAC solders.</p>

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Thermal, electrical, and mechanical properties of Sn–Bi solder joints for SMT soldering

  • 期刊论文

  • 发表日期：

    2025年10月22日

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  • Serdar Aktürk,
  • Sezen Aksöz,
  • Pınar Ata Esener

摘要

Lead-free alternatives to traditional tin–lead (Sn–Pb) solders are becoming increasingly important due to environmental and health concerns. In this study, alloys suitable for Surface Mount Technology (SMT) soldering were produced by adding copper (Cu), antimony (Sb), and zinc (Zn) to the Sn-10Bi (tin–bismuth) base alloy. The thermal conductivity, electrical conductivity, microstructure, microhardness, and tensile strength of Sn-10Bi-0.8Cu, Sn-10Bi-0.8Cu-1Zn, Sn-10Bi-5Sb, and Sn-10Bi-5Sb-1Zn were investigated. Sn-10Bi-0.8Cu exhibited the highest thermal and electrical conductivity at room temperature, with values ​​of 55.84 W/Km and 0.0869 × 108/Ωm, respectively, while the Sn-10Bi-5Sb-1Zn alloy exhibited superior mechanical strength, with values ​​of 61.75 HV and 83.04 MPa. Considering performance, cost, and reliability, Sn-10Bi-5Sb and Sn-10Bi-0.8Cu offer promise as practical, lead-free alternatives to Sn–Pb and SAC solders.