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<p>Meeting the stringent requirements for low-surface roughness and high-reliability copper foils in energy storage and electric vehicles necessitates overcoming critical challenges tied to the dynamic interfacial interactions at titanium cathodes and copper foil during electrodeposition. This study systematically investigates how cathode surface roughness and hydrogen evolution duration govern microstructural evolution and functional properties in electrolytic copper foils. A critical roughness threshold (1.4&#xa0;μm–1.6&#xa0;μm) was identified: Reducing cathode roughness from 2.5&#xa0;μm to 1.4&#xa0;μm significantly enhances the Cu (220) orientation (increasing from 18.8% to 46.1%) while suppressing the Cu (111) plane (decreasing from 64.1% to 38.5%). This crystallographic shift correlates with substantial improvements in conductivity (from 88.96% to 95.48% IACS) and tensile strength (from 129.53&#xa0;MPa to 380.3&#xa0;MPa). This optimization stems from uniform nucleation sites fostering columnar grains with dominant (220) orientation, thereby minimizing grain boundary scattering. Conversely, excessive smoothing (Ra &lt; 1.2&#xa0;μm) reduces nucleation site density, promoting abnormal grain growth and porosity that degrade elongation by ~ 35%. Contrary to static substrate assumptions, hydrogen evolution exerts a time-dependent, dual-phase influence: An initial beneficial phase (0–1.5&#xa0;h) polishes the cathode, enhancing scratch uniformity, nucleation density, and grain refinement (Ra≈1.6&#xa0;μm), leading to peak elongation (2.62%). However, prolonged operation (&gt; 1.5&#xa0;h) initiates a detrimental phase characterized by hydride (TiH₁.₅) formation. This induces stress corrosion, causing honeycomb defects (increasing Ra by ~ 55%) and degrading conductivity (by ~ 30%). Crucially, deposition dynamics are dictated by cathode topography: Smooth cathodes (Ra = 1.4&#xa0;μm) yield uniform spherical Cu particles (~ 2.2&#xa0;μm), whereas rough surfaces (Ra = 2.5&#xa0;μm) produce anisotropic dendritic aggregates (&gt; 5&#xa0;μm) riddled with voids. These mechanistic insights establish operational frameworks for microstructure control in copper foil manufacturing, directly addressing performance bottlenecks in advanced battery technologies.</p>

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Influence of titanium cathode state on the microstructure and properties of electrolytic copper foil

  • 期刊论文

  • 发表日期：

    2025年10月15日

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  • Yiping He,
  • Jianhua Yang,
  • Zhongbo Bai,
  • Kejun Yang,
  • Xiaolin Peng,
  • Hui Cai,
  • Jingli Zhang,
  • Eryong Liu

摘要

Meeting the stringent requirements for low-surface roughness and high-reliability copper foils in energy storage and electric vehicles necessitates overcoming critical challenges tied to the dynamic interfacial interactions at titanium cathodes and copper foil during electrodeposition. This study systematically investigates how cathode surface roughness and hydrogen evolution duration govern microstructural evolution and functional properties in electrolytic copper foils. A critical roughness threshold (1.4 μm–1.6 μm) was identified: Reducing cathode roughness from 2.5 μm to 1.4 μm significantly enhances the Cu (220) orientation (increasing from 18.8% to 46.1%) while suppressing the Cu (111) plane (decreasing from 64.1% to 38.5%). This crystallographic shift correlates with substantial improvements in conductivity (from 88.96% to 95.48% IACS) and tensile strength (from 129.53 MPa to 380.3 MPa). This optimization stems from uniform nucleation sites fostering columnar grains with dominant (220) orientation, thereby minimizing grain boundary scattering. Conversely, excessive smoothing (Ra < 1.2 μm) reduces nucleation site density, promoting abnormal grain growth and porosity that degrade elongation by ~ 35%. Contrary to static substrate assumptions, hydrogen evolution exerts a time-dependent, dual-phase influence: An initial beneficial phase (0–1.5 h) polishes the cathode, enhancing scratch uniformity, nucleation density, and grain refinement (Ra≈1.6 μm), leading to peak elongation (2.62%). However, prolonged operation (> 1.5 h) initiates a detrimental phase characterized by hydride (TiH₁.₅) formation. This induces stress corrosion, causing honeycomb defects (increasing Ra by ~ 55%) and degrading conductivity (by ~ 30%). Crucially, deposition dynamics are dictated by cathode topography: Smooth cathodes (Ra = 1.4 μm) yield uniform spherical Cu particles (~ 2.2 μm), whereas rough surfaces (Ra = 2.5 μm) produce anisotropic dendritic aggregates (> 5 μm) riddled with voids. These mechanistic insights establish operational frameworks for microstructure control in copper foil manufacturing, directly addressing performance bottlenecks in advanced battery technologies.