<p>The increasing demand for enhanced thermal stability and power density in electric vehicle (EV) power modules presents challenges for conventional packaging technologies, including inadequate thermal conductivity, limited high-temperature reliability, and suboptimal environmental compatibility. This review systematically summarizes recent advances in two pivotal high-temperature electronic packaging technologies: sintering and transient liquid phase (TLP) bonding. It examines microstructural regulation mechanisms in silver (Ag), copper (Cu), and nickel (Ni)-based sintering materials for power module applications. The analysis covers the effects of particle size, morphology, and solvent selection on sintering density, electrical and thermal conductivity, and mechanical strength. A comparative assessment of advanced processes such as pressure sintering, pressureless sintering, and laser-assisted sintering is presented, focusing on their mechanisms for reducing porosity, mitigating oxidation, and enhancing interface bonding strength. Additionally, TLP bonding characteristics are explored, emphasizing its advantages in low-temperature connections and high-temperature performance via high-melting point intermetallic compounds. The findings show that sintering technology provides a robust solution for high-temperature packaging with superior thermal conductivity and mechanical strength, while TLP enhances high-temperature stability. Future research should optimize multimodal particle design, develop cost-effective, sustainable materials, and integrate processes like ultrasound and induction heating to expand these technologies' application in wide-bandgap semiconductor devices.</p>