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<p>Systematic analysis of PCB–ENIG corrosion behavior and mechanism in Wanning and Yantai atmospheric environment was performed by 12&#xa0;months of exposure tests under shed. The results demonstrated that in Wanning atmospheric environment, the impedance value initially increased and then decreased, on account of the formation of corrosion products and galvanic system between Au/Ni and Au/Cu. In Yantai atmospheric environment, the impedance value exhibited an increasing trend, as SO<sub>2</sub> accelerated microporous corrosion and corrosion products deposition. PCB–ENIG primarily exhibited microporous corrosion in the two environment. However, the higher concent of SO<sub>2</sub> promoted the acidic liquid film, and accelerated the formation of CuSO<sub>4</sub>·3Cu(OH)<sub>2</sub> and NiSO<sub>4</sub>. Under 12&#xa0;V bias voltages, varying degrees of ECM were observed on PCB–ENIG, with migration of Ni and Cu. Notably, Ni exhibited enhanced migration capability in Yantai atmospheric environment, which was attributed to SO<sub>2</sub> promoted the micropore corrosion and accelerated the Ni dissolution.</p>

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Corrosion behavior and mechanism of PCB–ENIG in marine atmospheric environment

  • 期刊论文

  • 发表日期：

    2025年8月30日

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  • Cong Liu,
  • Yuzhu Li,
  • Xianping Fan,
  • Qiang Xu,
  • Jie Liu

摘要

Systematic analysis of PCB–ENIG corrosion behavior and mechanism in Wanning and Yantai atmospheric environment was performed by 12 months of exposure tests under shed. The results demonstrated that in Wanning atmospheric environment, the impedance value initially increased and then decreased, on account of the formation of corrosion products and galvanic system between Au/Ni and Au/Cu. In Yantai atmospheric environment, the impedance value exhibited an increasing trend, as SO2 accelerated microporous corrosion and corrosion products deposition. PCB–ENIG primarily exhibited microporous corrosion in the two environment. However, the higher concent of SO2 promoted the acidic liquid film, and accelerated the formation of CuSO4·3Cu(OH)2 and NiSO4. Under 12 V bias voltages, varying degrees of ECM were observed on PCB–ENIG, with migration of Ni and Cu. Notably, Ni exhibited enhanced migration capability in Yantai atmospheric environment, which was attributed to SO2 promoted the micropore corrosion and accelerated the Ni dissolution.