High reliable and ultra-flexible Cu grid@SnO2 transparent conductive thin films
摘要
Copper grids have been widely applied as flexible transparent conducting thin films, but they are rarely used in electronic devices due to the rapid surface oxidation of copper. In this paper, we develop a solution-phase process to prepare ultrathin SnO2 layers on the surface of Cu grids using tin difluoride solution as the starting material. This method effectively improves the reliability of copper grids without significant deterioration in optical and electrical performance (before coating SnO2: 0.96 Ω/sq. at 90.1%; after coating SnO2: 0.96 Ω/sq. at 89.7%). Moreover, the resistance of Cu grid@SnO2 thin films remains stable after 1500 bending cycles at a curvature radius of 15 μm, showing exceptional mechanical flexibility and foldability. In particular, the Cu grid@SnO2 thin films exhibit strong stability against vulcanization, oxidation, and chemical corrosion. Finally, flexible transparent heaters using the composite Cu grid@SnO2 thin films as electrodes are realized, demonstrating excellent thermal properties.