Scholarlink

<p>With the rapid advancement of chip packaging technologies, the continuous miniaturization and increased density of solder joints in board-level packages have significantly heightened mechanical stresses, thereby intensifying failure concerns. As a result, accurately predicting the service life of solder joints under mechanical loading conditions has become critically important. This study examines the board-level reliability of SAC305 solder joints subjected to vibration loads ranging from 6.5 to 15g, employing both experimental testing and finite element analysis (FEA). Experimental results indicate that PCB strain increases proportionally with acceleration, with the central region exhibiting a maximum strain of 0.00102 mm/mm at 15g, compared to 0.00033 mm/mm at the edge. FEA simulations closely matched the experimental data, with the simulated central strain differing by less than 10%, thereby validating the accuracy of the model. Furthermore, simulations revealed that solder joints located at the chip corners are subjected to higher stress—up to 38.14 MPa on the PCB side versus 12.9 MPa on the chip side. This stress distribution aligns with the observed failure behavior, where 65% of cracks occurred at the PCB-side intermetallic compound (IMC) layer. Modal analysis identified the PCB’s first-order natural frequency as 258.36 Hz, underscoring the critical role of dynamic response in stress distribution. Failure modes remained consistent across all load conditions and included interfacial failures (65%), bulk solder cracks (15%), and mixed-mode cracks (20%). No significant variation in failure mode distribution was observed with increasing vibration intensity. These findings provide vital insights into the failure mechanisms of solder joints and provide theoretical support for improving the reliability of board-level packaging under vibrational stress.</p>

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Correlation analysis of PCB strain and solder joint stress for board-level packaging reliability under variable acceleration loads

  • 期刊论文

  • 发表日期：

    2025年7月28日

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  • Jun Wang,
  • Liwei Guo,
  • Zehou Li,
  • Xuening Jiang,
  • Tianqi Xue,
  • Jicun Lu,
  • Yang Liu

摘要

With the rapid advancement of chip packaging technologies, the continuous miniaturization and increased density of solder joints in board-level packages have significantly heightened mechanical stresses, thereby intensifying failure concerns. As a result, accurately predicting the service life of solder joints under mechanical loading conditions has become critically important. This study examines the board-level reliability of SAC305 solder joints subjected to vibration loads ranging from 6.5 to 15g, employing both experimental testing and finite element analysis (FEA). Experimental results indicate that PCB strain increases proportionally with acceleration, with the central region exhibiting a maximum strain of 0.00102 mm/mm at 15g, compared to 0.00033 mm/mm at the edge. FEA simulations closely matched the experimental data, with the simulated central strain differing by less than 10%, thereby validating the accuracy of the model. Furthermore, simulations revealed that solder joints located at the chip corners are subjected to higher stress—up to 38.14 MPa on the PCB side versus 12.9 MPa on the chip side. This stress distribution aligns with the observed failure behavior, where 65% of cracks occurred at the PCB-side intermetallic compound (IMC) layer. Modal analysis identified the PCB’s first-order natural frequency as 258.36 Hz, underscoring the critical role of dynamic response in stress distribution. Failure modes remained consistent across all load conditions and included interfacial failures (65%), bulk solder cracks (15%), and mixed-mode cracks (20%). No significant variation in failure mode distribution was observed with increasing vibration intensity. These findings provide vital insights into the failure mechanisms of solder joints and provide theoretical support for improving the reliability of board-level packaging under vibrational stress.