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<p>Cu–Sn-based solders are widely used in electronic packaging because they can form intermetallic compounds (IMCs) at relatively low temperatures, meeting the requirements for "low-temperature processing and high-temperature service." However, void formed during the soldering process has limited their broader application. This study investigates the role of nickel in reducing void in solder joints by incorporating different amounts of nickel nanopowder and further examines the optimal nickel content for minimising void. The results show that nickel exists in three forms: metallic nickel, Cu–Ni solid solutions, and Ni–Sn intermetallic compounds. And nickel powder suppresses Cu–Sn IMC formation. When the nickel content is approximately 1&#xa0;wt.%, the suppression of the Cu–Sn reaction is moderate, which not only reduces void formation but also preserves the formation of a continuous intermetallic compounds network. This study provides valuable theoretical insights into reducing void in Cu–Sn-based solder joints and offers guidance for improving joint performance.</p>

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Effect of nickel on the Cu–Sn based joint material

  • 期刊论文

  • 发表日期：

    2025年6月21日

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  • Hanbing Li,
  • Hui Jiang,
  • Jun Shen,
  • D. Luo,
  • Q. Chen

摘要

Cu–Sn-based solders are widely used in electronic packaging because they can form intermetallic compounds (IMCs) at relatively low temperatures, meeting the requirements for "low-temperature processing and high-temperature service." However, void formed during the soldering process has limited their broader application. This study investigates the role of nickel in reducing void in solder joints by incorporating different amounts of nickel nanopowder and further examines the optimal nickel content for minimising void. The results show that nickel exists in three forms: metallic nickel, Cu–Ni solid solutions, and Ni–Sn intermetallic compounds. And nickel powder suppresses Cu–Sn IMC formation. When the nickel content is approximately 1 wt.%, the suppression of the Cu–Sn reaction is moderate, which not only reduces void formation but also preserves the formation of a continuous intermetallic compounds network. This study provides valuable theoretical insights into reducing void in Cu–Sn-based solder joints and offers guidance for improving joint performance.